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Polymer Property : Mold Temperature = 190 °C Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LARPEEK 10 K/40 40% Carbon Fiber Reinforced Polyetheretherketone (PEEK)
(Unverified Data**) Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°.. |
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LARPEEK 50 G/60 60% Glass Reinforced Polyetheretherketone (PEEK)
(discontinued **) Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°.. |
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LARPEEK 50 K/30 30% Carbon Fiber Reinforced Polyetheretherketone (PEEK)
(Unverified Data**) Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°.. |
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | Long flow or thin wall parts or for low residual stress |
| Solvay Specialty Polymers Supradel® HTS-2401 High Temperature Sulfone Resin
(discontinued **) Supradel HTS-2401 is a high-temperature high-performance amorphous sulfone polymer designed for use in reinforced high temperature thermoplastic formulations. With its glass transition temperature o.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties
(discontinued **) Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 84 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets, High Mechanical Strength
& Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, moldin.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, .. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures
(disconti Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application .. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued ** Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed
&nbs Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage
(discontinued **)& Phenolic molding compound, inorganically/organically filled, good dimensional stability, low shrinkage.Application areas: Housing parts for gas meter.Information provided by Bak AGBak AG became a pa.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak .. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ X24 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005. |
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | |
| Lehmann & Voss LUVOCOM® PEEK CLASSIX 7994 PEEK, unreinforced Applications: medical engineeringEspecially suitable for medical parts, superheated steam sterilizable, hydrolysis resistanceHigh chemical resistance parts, non flammable.Inherent flame resistance.S.. |
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | |
| Lehmann & Voss LUVOCOM® PEEK CLASSIX 7980 PEEK, with carbon fiber Applications: medical engineeringHigh-strength and high-stiff parts; low coefficient of expansion.Dynamic stressed parts at high movement velocity.Chemical and hydrolysis resistance parts, non flamm.. |
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| Mold Temperature | 150 - 190 °C | 302 - 374 °F | Injection molding |
| BASF Ultrason® E 2010 C6 30% Carbon Filled Carbon fibers and Ultrason® two partners with good properties. The combination of carbon fibers with the amorphous high-temperature plastic Ultrason® guarantees mechanical properties for temperatu.. |
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LARPEEK 50 G/20 20% Glass Reinforced Polyetheretherketone (PEEK)
(discontinued **) Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°.. |
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | |
| Raschig Group 5557 DAP
(discontinued **) Glass fiber-reinforced and inorganically filled diallylphthalate molding compound (DAP) in various colors. Good mechanical strength together with retention of high electrical properties under hot h.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant.Application areas: Thermally and dyna.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 1142 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **) Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability, good mechanical properties.Application areas: Insulating flanges, sealings, pulleys.Information p.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol.. |
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