Polymer Property : Cure Time = 4.00 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	120 - 240 min @Temperature 66.0 Â°C	2.00 - 4.00 hour @Temperature 151 Â°F
Lord Adhesives Thermosetâ„¢ UR-340 Two Component Urethane Encapsulant Lord UR-340 is a two component, room temperature curing, urethane encapsulating compound. It is low in viscosity and has excellent flow characteristics. Its flexibility, low modulus characteristics,..
Cure Time	180 - 240 min @Temperature 121 - 149 °C	3.00 - 4.00 hour @Temperature 250 - 300 °F
Master Bond EP45HTND-2 Chemically Resistant, Non-Drip Epoxy Description: Master Bond EP45HTND-2 is a two component epoxy system for high performance bonding, sealing and coating. It is used for applications requiring solid temperature resistance and capable ..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 716C01 Medium Viscosity Epoxy Adhesive TRA-BOND 716C01 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications. This two-part amber adhesive is easily mixed, used and cured at room temperature..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond FDA25 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-25 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admi..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Duct 916H04 Room Temperature Cure, Conductive Silver Epoxy Adhesive TRA-DUCT 916H04 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical pr..
Cure Time	120 - 240 min @Temperature 65.0 °C	2.00 - 4.00 hour @Temperature 149 °F
Trelleborg Emerson & Cuming Eccobond® 15 LV Clear Variable Hardness Low Viscosity Catalyst Emerson & Cuming 15 LV Clear Eccobond® Variable Hardness Low Viscosity CatalystLow viscosity. Easy-to-use, simple mix ratios. Hardness of cured castings can be controlled by the amount of hardener ..
Cure Time	180 - 240 min @Temperature 93.3 °C	3.00 - 4.00 hour @Temperature 200 °F
Master Bond EP30M3LV Electrically Insulative, Low Viscosity Two Component Epoxy Master Bond Polymer System EP30M3LV is a lower viscosity, two component epoxy system for high performance bonding, sealing and encapsulation. It is formulated to cure at ambient temperatures or mor..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond FS437 Low Viscosity High Impact Epoxy Adhesive TRA-BOND FS437 is a two-part, low viscosity material formulated for optical applications which require excellent wicking, visible color and high strength. This material has been used successfully fo..
Cure Time	120 - 240 min @Temperature 25.0 °C	2.00 - 4.00 hour @Temperature 77.0 °F
ACC QGel 315 QSI Quantum Silicones General Purpose Silicone Gel QGel 315 is a clear, very soft, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid..
Cure Time	120 - 240 min @Temperature 65.0 °C	2.00 - 4.00 hour @Temperature 149 °F
Atom Adhesives AA-BOND 2153 Epoxy Adhesive AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Atom Adhesives AA-BOND FDA2 Epoxy Adhesive AA-BOND FDA2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and recei..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Atom Adhesives AA-DUCT 916 Epoxy Adhesive AA-DUCT 916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good elect..
Cure Time	60.0 - 240 min @Temperature 160 - 180 °C	1.00 - 4.00 hour @Temperature 320 - 356 °F	optional
Abatron AboCast 8103-14 One-Component Epoxy AboCast 8103-14 is the lowest-viscosity one-component epoxy system with heavy-duty structural and dielectric properties. It is clear and has maximum wetting and penetration. Suggested Uses: Casting..
Cure Time	60.0 - 240 min @Temperature 120 - 160 °C	1.00 - 4.00 hour @Temperature 248 - 320 °F	optional
Abatron AboCast 8103-25 High-Performance Dielectric Epoxy AboCast 8103-25 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system combines o..
Cure Time	120 - 240 min @Temperature 100 °C	2.00 - 4.00 hour @Temperature 212 °F	2nd step
Abatron AboCast 8502-7/AboCure 8502-7 Colorless, Low-Exotherm Epoxy Casting Compound AboCast 8502-7/AboCure 8502-7 is a rigid, heat cured, colorless, low-exotherm epoxy casting compound for larger masses. It is a 2-component structural and dielectric liquid system with extremely low..
Cure Time	120 - 240 min @Temperature 125 °C	2.00 - 4.00 hour @Temperature 257 °F	optional 3rd step
Abatron AboCast 8502-7/AboCure 8502-7 Colorless, Low-Exotherm Epoxy Casting Compound AboCast 8502-7/AboCure 8502-7 is a rigid, heat cured, colorless, low-exotherm epoxy casting compound for larger masses. It is a 2-component structural and dielectric liquid system with extremely low..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Atom Adhesives AA-BOND FDA16 Epoxy Adhesive AA-BOND FDA16 is a medium viscosity epoxy resin system specifically developed for medical device applications. AA-BOND FDA16 has been tested in accordance with USP biological reactivity tests, in vi..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Atom Adhesives AA-BOND FDA26 Epoxy Adhesive AA-BOND FDA26 is Versatile adhesive guaranteed a high strength bond. AA-BOND FDA26 is two part adhesive used and cured at room temperature for bonding, repair applications by manufacturers of food p..
Cure Time	120 - 240 min @Temperature 65.0 °C	2.00 - 4.00 hour @Temperature 149 °F
Atom Adhesives AA-SUPERTHERM 195 Epoxy Adhesive AA-SUPERTHERM 195 is a two component, thermally conductive epoxy system recommended for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed cir..
Cure Time	180 - 240 min @Temperature 23.9 °C	3.00 - 4.00 hour @Temperature 75.0 °F
Master Bond EP30M4LV Chemically Resistant, Low Viscosity Adhesive Description: Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weig..