Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Atom Adhesives AA-BOND 2153 Epoxy Adhesive

Category Polymer , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Atom Adhesives
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Atom Adhesives AA-BOND 2153 Epoxy Adhesive.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. AA-BOND 2153 is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. AA-BOND 2153 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials. AA-BOND 2153 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals.Appearance: Dark GreyCure Type: Heat cure or Room TemperatureBenefits:StrongDurableHigh impact bonds at room temperature Mix Ratio by weight: 100:7/Resin:Hardener Typical Application: Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boardsInformation provided by Atom Adhesives
Physical Properties Metric English Comments
Specific Gravity 2.44 g/cc
2.44 g/cc
uncured
Solids Content 100 %
100 %
reactive, uncured
Mechanical Properties Metric English Comments
Hardness, Shore D 90
90
Thermal Properties Metric English Comments
CTE, linear 18.0 µm/m-°C
10.0 µin/in-°F
Thermal Conductivity 1.00 W/m-K
6.94 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 110 °C
230 °F
Minimum Service Temperature, Air -70.0 °C
-94.0 °F
Glass Transition Temp, Tg 110 °C
230 °F
Electrical Properties Metric English Comments
Volume Resistivity 5.50e+15 ohm-cm
5.50e+15 ohm-cm
4.00e+13 ohm-cm

@Temperature 100 °C
4.00e+13 ohm-cm

@Temperature 212 °F
Dielectric Constant 6.0

@Frequency 1000 Hz
6.0

@Frequency 1000 Hz
Dielectric Strength 16.1 kV/mm
410 kV/in
Dissipation Factor 0.010

@Frequency 1000 Hz
0.010

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 120 - 240 min

@Temperature 65.0 °C
2.00 - 4.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 30.0 min
30.0 min
uncured
Shelf Life 12.0 Month
12.0 Month
Copyright © lookpolymers.com All Rights Reserved