Polymer Property : Cure Time = 24.0 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
NextGen Adhesives G907-31 Epoxy Adhesive Description: NGAC G907-31 is a medium viscosity epoxy adhesive system utilized extensively in industrial and structural applications.Advantages and Applications: The NGAC G907-31 provides excellent ..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers FFM-1 Firm-Grade Flexible Open-Cell Foam This foam formulation is particularly designed to make flexible but firm open-cell foam by either hand-mixing or machine casting. This material may be suitable for products that require some load b..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MPS-F08A Hand-Mixable Flexible Foam This foam formulation is designed to make molded flexible foam parts/sheets/dies/blocks by hand-mixing or machine casting by the meter dispensing equipment. The components are stable and liquid at ..
Cure Time	1440 - 2880 min @Temperature 25.0 °C	24.0 - 48.0 hour @Temperature 77.0 °F
Resinlab® EP1390 Medium Viscosity, Self Extinguishing Flame Retardant Epoxy Casting Resin System Resinlab™ EP1390 is a RoHS compliant, medium viscosity, self extinguishing flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Labor..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP21ARHT Two component epoxy adhesive, sealant, coating and encapsulating system Product Description: Master Bond EP21ARHT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a convenient 100 to 50 mix ratio by weight an..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP30P Epoxy Bonds Glass, Polycarbonates and Acrylics Description: Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is for..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond 2135D High Impact Epoxy Adhesive TRA-BOND 2135D is a medium viscosity epoxy adhesive recommended for bonding, laminating, sealing, and structural repair applications where easy mixing and good wetting combined with high impact stre..
Cure Time	1440 min @Temperature 60.0 °C	24.0 hour @Temperature 140 °F
Tra-Con Tra-Bond 293-1.5T General Purpose Instrument Epoxy Adhesive-Flexible TRA-BOND 293-1.5T general purpose epoxy adhesive is designed to provide strong, semi-rigid bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. This v..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond 342-14T Low Viscosity Room Temperature Cure Epoxy Adhesive TRA-BOND 342-14T single component, low viscosity alumina-filled epoxy adhesive exhibits high bond strength and excellent thermal shock characteristics. This adhesive may be cured at room temperature..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond FDA22 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini..
Cure Time	1440 min @Temperature 65.0 °C	24.0 hour @Temperature 149 °F
Tra-Con Tra-Duct 921M01 Low Viscosity Long Pot Life Silver-Filled Epoxy TRA-DUCT 921M01 is a two component, silver-filled electrically conductive epoxy adhesive designed for applications which require electrical conductivity and a long pot life at a relatively low heat ..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Trelleborg Emerson & Cuming Eccobond® TP 50 Two-Component Low Temperature Performance Silicone Adhesive Emerson & Cuming TP 50 Eccobond® Two-Component Low Temperature Performance Silicone AdhesiveFilled, RTV silicone rubber, paste adhesive. Room temperature cure. Very flexible. Color coded for ease o..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Master Bond EP34 Room Temperature Curing Two Component Epoxy System Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. Adhesion to metals, glass, ceramics, woo..
Cure Time	1440 - 2160 min @Temperature 23.9 °C	24.0 - 36.0 hour @Temperature 75.0 °F
Master Bond Supreme 11AO Electrically Isolating Adhesive and Sealant Description: Master Bond Polymer System SURPEME 11AO is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated..
Cure Time	1440 min @Temperature 43.0 °C	24.0 hour @Temperature 109 °F	Full Chemical
Chesterton ARC 890 Course Grade Sliding Wear Compound An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at the thickness of 6 mm (1/4”)..
Cure Time	1440 min @Temperature 43.0 °C	24.0 hour @Temperature 109 °F	Full Chemical
Chesterton ARC I BX1 Impact & Wear Resistant Epoxy Composite Description: An advanced grade epoxy and urethane composite for the repair and protection of all metal surfaces subjected to severe abrasion and impact. It is normally applied at a thickness of 6 mm..
Cure Time	1440 min @Temperature 10.0 °C	24.0 hour @Temperature 50.0 °F	Light Load
Chesterton ARC SD4i High temperature ceramic reinforced erosion resistant coating Description: An advanced ceramic composite for resurfacing and protection of metal surfaces in immersion service. It is normally applied in a thickness range of 250-370 microns (10-15 mils) per coat..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F	Full Load
Chesterton ARC SD4i High temperature ceramic reinforced erosion resistant coating Description: An advanced ceramic composite for resurfacing and protection of metal surfaces in immersion service. It is normally applied in a thickness range of 250-370 microns (10-15 mils) per coat..
Cure Time	1440 min @Temperature 23.0 °C	24.0 hour @Temperature 73.4 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F	Recommended Cure
Aremco Aremco-Bond™ 2210 High Performance Epoxide Aluminum and Ceramic-Filled, Vibration and Impact Resistant, for Repairing Aluminum Mold and Wear Surfaces.
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F	Alternate
Aremco Aremco-Bond™ 657 High Performance Epoxide Stainless Steel-Filled, High Corrosion Resistance.
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Atom Adhesives AA-BOND FDA2T Epoxy Adhesive AA-BOND FDA2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received ..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Atom Adhesives AA-DUCT 2919 Epoxy Adhesive AA-DUCT 2919 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require good flexibility coupled w..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Atom Adhesives AA-BOND F156 Epoxy Adhesive AA-BOND F156 is a black, solvent free thixotropic epoxy recommended for high quality photographic industry, laminating, production and repair applications where a room temperature cure optically opa..
Cure Time	1440 min @Temperature 23.0 °C	24.0 hour @Temperature 73.4 °F	M10 steel, full strength
Permabond A118 Anaerobic Retainer Permabond® A118 is an anaerobic adhesive designed to provide permanent locking and sealing of metal parts such as bearings, gears, studs and other threaded components. It exhibits high strength, ex..