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Polymer Property : Cure Time = 90.0 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 90.0 min @Temperature 182 °C |
1.50 hour @Temperature 360 °F |
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| Parker Chomerics CHO-FLEX 601 Conductive Coating CHO-FLEX™ 601 coating is specifically designed for EMI shielding of copper/Kapton flexible circuit laminates and for printing circuits on Kapton film. Upon cure, this coating exhibits excellent adh.. |
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| Cure Time | 90.0 min @Temperature 177 °C |
1.50 hour @Temperature 351 °F |
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| Henkel Hysol EA 9695 Film Adhesive Second generation, low flow, composite bonding film; excellent environmental resistance. Composite structure repair, cure and co-cure with composite laminates. Qualified to Airbus. Data from .050 ps.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol EA 9695 Film Adhesive Second generation, low flow, composite bonding film; excellent environmental resistance. Composite structure repair, cure and co-cure with composite laminates. Qualified to Airbus. Data from .050 ps.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol MA 562S Core Splice Adhesive Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Nonmetallic, medium tack, excellent slump resistance. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol PL 795-1 Film Adhesive Tougher version of Hysol PL 795. Excellent flow characteristics. Excellent tack and handling characteristics. Improved elevated temperature performance. Can be used for both surfacing film and light.. |
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| Cure Time | 90.0 min @Temperature 95.0 °C |
1.50 hour @Temperature 203 °F |
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| Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se.. |
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| Cure Time | 90.0 min @Temperature 95.0 °C |
1.50 hour @Temperature 203 °F |
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| Tra-Con Tra-Bond 293-1M General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1M general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper and brass. The 293-se.. |
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| Cure Time | 90.0 min @Temperature 100 °C |
1.50 hour @Temperature 212 °F |
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| Trelleborg Emerson & Cuming Eccobond® G 909 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming G 909 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, thixotropic, flexible, epoxy adhesive. High peel strength (30 pli). Recommended for bonding copper, aluminum an.. |
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| Cure Time | 90.0 min @Temperature >=105 °C |
1.50 hour @Temperature >=221 °F |
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| Trelleborg Emerson & Cuming Eccobond® 1962-31 Needle Bonding Epoxy Adhesive Emerson & Cuming 1962-31 Eccobond® Needle Bonding Epoxy AdhesiveOne component, medium viscosity, epoxy needle bonding adhesive. Designed to bond stainless steel cannulae into polypropylene hubs. Al.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC 890 Course Grade Sliding Wear Compound An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at the thickness of 6 mm (1/4”).. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC BX1 Sliding Wear Compound Description: An advanced contractor grade ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at.. |
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| Cure Time | 90.0 min @Temperature 21.0 °C |
1.50 hour @Temperature 69.8 °F |
Foot Traffic |
| Chesterton ARC NVE SYSTEM Vinyl Ester Lining Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i.. |
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| Cure Time | 90.0 min @Temperature 21.0 °C |
1.50 hour @Temperature 69.8 °F |
Light Load |
| Chesterton ARC NVE SYSTEM Vinyl Ester Lining Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i.. |
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| Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
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| Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos.. |
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| Cure Time | 90.0 min @Temperature 165 °C |
1.50 hour @Temperature 329 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec.. |
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| Cure Time | 90.0 min @Temperature 285 °C |
1.50 hour @Temperature 545 °F |
Post-Cure, Minimum Bond Line |
| Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC MX2 High Wear Fine Particle Wear Compound Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion and chemical attack. It is applied at a thickness of 3 mm (1/8”.. |
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| Cure Time | 90.0 min @Temperature 25.0 °C |
1.50 hour @Temperature 77.0 °F |
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| ACC QGel 311 QSI Quantum Silicones General Purpose Silicone Gel QGel 311 is a clear, fast cure, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid.. |
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| Cure Time | 90.0 min @Temperature 180 °C |
1.50 hour @Temperature 356 °F |
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| Atom Adhesives AA-DUCT CG2 Epoxy Adhesive AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulati.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol PL 795 Film Adhesive Epoxy film adhesive designed for composite bonding applications. May cure at 250°F / 121°C or 350°F / 177°C, with service temperatures up to 350°F / 177°C. Ideal for co-cure or secondary bondi.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton MRS 58 Metal Rebuilding System An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 1.5 mm (60 mils) or mo.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
|
| Henkel Hysol EA 9825 Paste Adhesive System Low-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting an.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
|
| Henkel Hysol PL 460 Core Splice Adhesive Foaming epoxy adhesive in paste form for easy extrusion through packaged cartridges. Expands and cures at temperatures from 250°F / 121°C to 350°F / 177°C. Qualified to Boeing BMS 5-90, Type IV... |
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