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Henkel Hysol PL 795 Film Adhesive

Category Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Henkel
Trade Name Hysol
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Henkel Hysol PL 795 Film Adhesive.pdf
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Material Notes:
Epoxy film adhesive designed for composite bonding applications. May cure at 250°F / 121°C or 350°F / 177°C, with service temperatures up to 350°F / 177°C. Ideal for co-cure or secondary bonding applications. Outstanding handling characteristics. Superior elevated temperature performance at 270°F / 132°C. Excellent out-time. Exceeds requirements of BMS 5-154. Can be used for both surfacing film and lightning strike applications.Applications: Composite Bonding Composite Surfacing
Physical Properties Metric English Comments
Storage Temperature -18.0 °C
-0.400 °F
Mechanical Properties Metric English Comments
Tensile Strength 5.90 MPa
856 psi
Flatwise
Adhesive Bond Strength 17.2 MPa

@Temperature 132 °C
2490 psi

@Temperature 270 °F
Lap Shear
24.1 MPa

@Temperature -55.0 °C
3500 psi

@Temperature -67.0 °F
Lap Shear
26.9 MPa

@Temperature 25.0 °C
3900 psi

@Temperature 77.0 °F
Lap Shear
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 177 °C
351 °F
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 177 °C
1.00 hour

@Temperature 351 °F
90.0 min

@Temperature 121 °C
1.50 hour

@Temperature 250 °F
Descriptive Properties Value Comments
Out-Time (days) 100
at 25°C
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