Polymer Property : Cure Time = 2880 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	2880 - 4320 min @Temperature 25.0 °C	48.0 - 72.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MPP-D65A Polyether Base Polyurethane Resin MPP-D65A is a polyether base 2-component polyurethane resin casting system for molding and potting applications. It has a long pot-life and gradual curing pattern to provide easier handling for mol..
Cure Time	2880 min @Temperature 23.0 °C	48.0 hour @Temperature 73.4 °F
Resin Technology Group 119-EX Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Cure Time	2880 - 4320 min @Temperature 25.0 °C	48.0 - 72.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers GK-22 Polyurethane Gel for Adhesion Pad Applications GK-22 is a polyurethane gel formulation designed to make soft sticky polyurethane gel for pressure-sensitive-adhesive type products. This 2-part cast urethane system can be manually processed easi..
Cure Time	2880 min @Temperature 25.0 °C	48.0 hour @Temperature 77.0 °F
Resin Technology Group TIGA 291-EX Grey Medium Viscosity Polyamide Epoxy Adhesive Mix ratio 1 to 1 by weight.Tiga 291 EX Grey is a medium viscosity polyamide/ epoxy adhesive recommended for bonding applications where high shock impact resistance and peel resistance are desired. T..
Cure Time	2880 - 10100 min @Temperature 23.0 °C	48.0 - 168 hour @Temperature 73.4 °F
Resin Technology Group UV MX-2240 Multi-Functional Hybrid, UV-Curing, Micro-Electronic System Mix ratio 2 to 1 by volume.UV-MX 2240 is a low-viscosity, water-white photo/ chemical cross-linking encapsulant/sealant designed for micro-electronic applications. This two-part, Hybrid UV-epoxy bas..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21AOLV-1 Two Part, Room Temperature Curing Epoxy System Product Description: Master Bond Polymer Adhesive EP21AOLV-1 is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant and coating. This versatile system will adhere t..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21HTND High Temperature Resistant, Non-Drip Epoxy Compound Description: Master Bond EP21HTND is a two component, room temperature curing epoxy adhesive, sealant and coating with a paste viscosity and non-drip application feature. Its features are easy handl..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21NDFG Two component epoxy compound for high performance applications Product Description: Master Bond EP21NDFG is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, easy processing and a non-drip, paste-like consistency..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP33CLV Epoxy Resists Chemicals and High Temperatures Description: Master Bond EP33CLV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and excel..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond MasterSil 153Med Silicone Paste for Medical Applications Description: Master Bond MasterSil 153Med is a two component silicone compound with a paste consistency for high performance bonding and sealing. It can be used for medical device applications as it..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond MasterSil 156 Two Part, Low Viscosity Silicone Description: Master Bond MasterSil 156 is a two component, lower viscosity silicone system for high performance potting, encapsulation and sealing. MasterSil 156 combines high temperature resistance..
Cure Time	2880 min @Temperature 25.0 °C	48.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond 342-3.5 Room Temperature Cure Epoxy Adhesive TRA-BOND 342-3.5 room temperature curing epoxy adhesive is designed for applications which require outstanding thermal shock properties. This adhesive may be used to bond semi-porous materials such ..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21FRNS-2 Two Component, Flame Resistant Epoxy System Master Bond Polymer System EP21FRNS-2 is a two component, room temperature curing, flame retardant compound for potting, encapsulating and casting. Particularly noteworthy are its low smoke generati..
Cure Time	2880 - 5760 min @Temperature 23.0 °C	48.0 - 96.0 hour @Temperature 73.4 °F
Master Bond EP21TDC-7 Highly Flexible Two Component Epoxy System Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or mor..
Cure Time	2880 - 4320 min @Temperature 23.0 °C	48.0 - 72.0 hour @Temperature 73.4 °F
Master Bond EP30M3LV Electrically Insulative, Low Viscosity Two Component Epoxy Master Bond Polymer System EP30M3LV is a lower viscosity, two component epoxy system for high performance bonding, sealing and encapsulation. It is formulated to cure at ambient temperatures or mor..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP42HT-2 Epoxy Adhesive Resists Sterilization Description: Master Bond Polymer System EP42HT-2 is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material featuring high temperature resistance along with o..
Cure Time	2880 min @Temperature 25.0 °C	48.0 hour @Temperature 77.0 °F	Full Chemical
Chesterton ARC 855 Abrasion Control Liquid Description: An advanced ceramic composite formulated to protect equipment from aggressive chemical attack, corrosion, and erosion. The product is a low viscosity composite that is easily applied by..
Cure Time	2880 min @Temperature 16.0 °C	48.0 hour @Temperature 60.8 °F	Full Load
Chesterton ARC BX1 Sliding Wear Compound Description: An advanced contractor grade ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at..
Cure Time	2880 min @Temperature 25.0 °C	48.0 hour @Temperature 77.0 °F	Full Chemical
Chesterton ARC BX2 Contractor Grade Fine Sliding Wear Compound Description: ARC BX2 is an advanced contractor grade ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It ..
Cure Time	2880 min @Temperature 25.0 °C	48.0 hour @Temperature 77.0 °F	Full Chemical
Chesterton ARC SD4i High temperature ceramic reinforced erosion resistant coating Description: An advanced ceramic composite for resurfacing and protection of metal surfaces in immersion service. It is normally applied in a thickness range of 250-370 microns (10-15 mils) per coat..
Cure Time	2880 min @Temperature 16.0 °C	48.0 hour @Temperature 60.8 °F	Full Load
Chesterton MRS SD4i Metal Rebuilding System An advanced ceramic composite for resurfacing and protection of metal surfaces in immersion service. It is normally applied in a thickness range of 250-370 microns (10 – 15 mils) per coat. Non-shri..
Cure Time	2880 min @Temperature 25.0 °C	48.0 hour @Temperature 77.0 °F	Full Chemical
Chesterton MRS SD4i Metal Rebuilding System An advanced ceramic composite for resurfacing and protection of metal surfaces in immersion service. It is normally applied in a thickness range of 250-370 microns (10 – 15 mils) per coat. Non-shri..
Cure Time	2880 min @Temperature 23.0 °C	48.0 hour @Temperature 73.4 °F	Minimum
Epoxy Technology EPO-TEK® T7109-19 Electrically Insulating Epoxy Paste Material Description: A flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is an alternative to EPO-TEK® T7109-17, de..
Cure Time	2880 min @Temperature 16.0 °C	48.0 hour @Temperature 60.8 °F	Full Load
Chesterton ARC MX2 High Wear Fine Particle Wear Compound Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion and chemical attack. It is applied at a thickness of 3 mm (1/8”..
Cure Time	2880 - 10080 min @Temperature 20.0 °C	48.0 - 168.0 hour @Temperature 68.0 °F	(2-7 Days)
Abatron AboCast 8005-6/AboCure 8005-6 Epoxy AboCast 8005-6 is a tan, viscous filled liquid resin with a weight of approximately 11 lbs/gallon. AboCure 8005-6 is an amber, viscous liquid converter with a weight of approximately 10 lbs/gallon. ..
Cure Time	2880 min @Temperature 25.0 °C	48.0 hour @Temperature 77.0 °F
Abatron L060421-1 Heat-Resistant (-75~400°F) Non-Flammable Silicone Rubber L060421-1 is a heat-resistant and non-flammable silicone rubber recommended as a potting compound for exceptional protection against thermal shock, vibration, moisture, ozone, dust, chemicals, and o..
Cure Time	2880 min @Temperature 23.0 °C	48.0 hour @Temperature 73.4 °F	Alternate Cure
Aremco Aremco-Bond™ 2300 High Performance Epoxide Milky Clear, 10:1, Low Viscosity, Exceptional Bond Strength.
Cure Time	2880 min @Temperature 25.0 °C	48.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond 724-17GR1B3 Polyurethane Adhesive TRA-BOND 724-17GR1B3 premixed and frozen polyurethane adhesive is designed for good adhesion, providing strong resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, myl..