Polymer Property : Pot Life = 180 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	180 - 240 min	180 - 240 min	Mass: 100g; TM R050-17
Resinlab® EP1285HD-12 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Pot Life	180 min	180 min	ASTM D4212
Parker Chomerics CHO-SHIELD® 4994 Conductive Flexible Coating Description: CHO-SHIELD® 4994 is a smooth, highly conductive flexible silver-filled polyurethane coating designed for military/aerospace airframe applications. Both coatings provide superior adhesi..
Pot Life	180 min	180 min
NextGen Adhesives EC907-34 Epoxy Adhesive Description: NGAC EC907-34 is a two part, electrically conductive silver filled epoxy adhesive which can be cured at room temperature. It was designed for applications requiring excellent mechanical..
Pot Life	180 min	180 min
Resin Technology Group H420 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life	180 min	180 min
Tra-Con Tra-Bond 2162D Color Coded Smooth Paste Epoxy Adhesive TRA-BOND 2162D epoxy system is color-coded for easy mixing and handling as a smooth paste, and it develops strong bonds to most materials including metals, glass, ceramics, leather, wood, concrete a..
Pot Life	180 min	180 min
Tra-Con Tra-Bond FDA22BK01 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22BK01 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance. This two-part black adhesive is easily mixed, used and cured at ..
Pot Life	180 min	180 min
Tra-Con Tra-Bond FDA8T Food and Drug Application Thixotropic Flexible Epoxy Adhesive TRA-BOND FDA-8T EPOXY ADHESIVE is a thixotropic epoxy resin system specifically developed for bonding applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini..
Pot Life	180 min	180 min
Tra-Con Tra-Cast 3011 Semi-Flexible Clear Epoxy Casting Compound TRA-CAST 3011 is a clear, low viscosity epoxy casting compound recommended for industrial embedding and casting applications where its combination of superior properties, good clarity, long pot life..
Pot Life	180 min	180 min
Tra-Con Tra-Cast FS330 Fire Retardant Long Pot Life Epoxy Casting Compound TRA-CAST FS330 is a low viscosity, long pot life, thermally conductive casting compound which passes UL 94 V-O. It is recommended for rigid potting, laminating, transformer encapsulating, filament w..
Pot Life	180 min	180 min
Tra-Con Tra-Duct 2916T Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2916T is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good el..
Pot Life	180 min	180 min
Tra-Con Tra-Bond 2158 Heat Conductive Electrically Insulating Compound TRA-BOND 2158 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards..
Pot Life	180 min	180 min	40 grams
Tra-Con Tra-Bond 216E01 Non-Sag Dam Applications Adhesive TRA-BOND 216E01 is a thixotropic, two-part adhesive formulated specifically for applications where a high-fill, non-sag adhesive is required. TRA-BOND 216E01 works in concert with TRA-BOND 216E02 to..
Pot Life	180 min	180 min
Tra-Con Tra-Bond RO7 Radio Opaque Epoxy Adhesive TRA-BOND RO-7 is a high viscosity epoxy resin system specifically developed for adhesive and coating applications where radio opacity is required. It can be used as an X-ray marker on in-vitro medic..
Pot Life	180 min	180 min
Tra-Con Tra-Cast 3143 Fire Retardant Epoxy Casting Compound TRA-CAST 3143 has a low viscosity and long pot life. It is certified to the requirements of UL 94 V-O, and is recommended for rigid potting, laminating, transformer encapsulating, filament winding a..
Pot Life	180 min	180 min
Cytec (Conap) FR-1050 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Pot Life	180 - 240 min	180 - 240 min
Epoxy Technology EPO-TEK® 353ND Black High Temperature Epoxy Product Description: EPO TEK® 353ND Black is a a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applicationsAdvantages & Application Notes: EPO T..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® 353ND-T High Temperature Thixotropic Epoxy Product Description: EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. Advantages & Application Notes: Suitable for fiber op..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® 353ND-T1 High Temperature Thixotropic Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed for fiber optic, electronics and medical applications. It is a more viscous alternative to EPO-TEK® 353ND-T.I..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® 353ND-T5 High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T5 is an intermediate viscosity version of EPO-TEK® 353ND and EPO-TEK® 353ND-T. It was designed for high temperature applications in fiber optics, electronics ..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® 430 Epoxy Product Description: A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding ..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® H54 High Temperature Epoxy Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca..
Pot Life	>= 180 min	>= 180 min
Epoxyset Epoxibond EB-119SP Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc...
Pot Life	180 - 240 min	180 - 240 min
Abatron AboSeal 8104-11 Polysulfide, Thixotropic Sealant and Caulk AboSeal 8104-11 is a 2-part, 100% solids, thixotropic polysulfide. It only comes in black. It is a standard for ships and aircraft. It is also excellent for architectural and industrial uses and hea..
Pot Life	180 - 300 min	180 - 300 min
Abatron AboThane 8901-4 Polyurethane Enamel Clear, glossy polyurethane enamel with good chemical, weather and abrasion resistance as a clear anti-graffiti coating. High-grade, high-build, 2-component system for good performance on metal, woo..
Pot Life	180 min	180 min	uncured
Atom Adhesives AA-DUCT 902LP Epoxy Adhesive AA-DUCT 902LP is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value ..
Pot Life	180 min @Temperature 100 °C	180 min @Temperature 212 °F
Abatron AboCast 8103-13 One-Component Epoxy AboCast 8103-13 is the low-viscosity one-component clear epoxy system with deep impregnation that offers high performance at relatively high temperatures. It is best for thin-wall casting. Suggested..
Pot Life	180 min @Temperature 24.0 °C	180 min @Temperature 75.2 °F	1 lb. mass
BCC Products BC 7136-2 Epoxy Casting BC7136-2 is an aluminum filled thick section casting system with heat resistance to 300ºF. May be cast to a thickness of 2 inches in non-conductive molds, 3 inches in conductive molds and thicker s..