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- Polymer Property : Pot Life = 180 min
Polymer Property : Pot Life = 180 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Pot Life | 180 min | 180 min | |
| Resin Technology Group H420 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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| Pot Life | 180 min @Temperature 100 °C |
180 min @Temperature 212 °F |
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| Huntsman HT 9664 Aromatic Amine Approx. H+ equivalent weight 63. Mix Ratio with GY 6010 is 36.Comments/Applications: Micropulverized HT 976: 4,4' -diaminodiphenyl sulfone (DDS). Solid amine with a melting point of 174 - 178°.. |
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| Pot Life | 180 min @Temperature 100 °C |
180 min @Temperature 212 °F |
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| Huntsman HT 976 Aromatic Amine Approx. H+ equivalent weight 63. Mix Ratio with GY 6010 is 36.Comments/Applications: 4,4'-diaminodiphenyl sulfone (DDS). Solid amine with a melting point of 174 - 178°C. Excellent high temper.. |
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| Pot Life | 180 min | 180 min | |
| Hybrid Plastics POSS® EP 1000 Epoxy Adhesive EP1000 is a POSS® based epoxy adhesive with outstanding oxidative resistance to ozone, plasma, or atomic oxygen environments. The EP1000 POSS® Epoxy is also well-suited for peroxide and steam... |
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| Pot Life | 180 min | 180 min | |
| Hybrid Plastics POSS® EP 2000 Epoxy Adhesive EP2000 is a POSS® based, ultra-high temperature epoxy adhesive. The POSS® content in EP2000 offers unique properties such as high thermal stability, outstanding oxygen and chemical resistance... |
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| Pot Life | 180 min | 180 min | 100 gram batch |
| Master Bond EP30-D10 Abrasion Resistant, Flexible Adhesive Compound Description: Master Bond Polymer System EP30-D10 is a versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bondin.. |
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| Pot Life | 180 min | 180 min | |
| Tra-Con Tra-Bond FDA22 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini.. |
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| Pot Life | 180 min | 180 min | |
| Tra-Con Tra-Bond FDA23 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-23 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini.. |
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| Pot Life | 180 min | 180 min | |
| Tra-Con Tra-Bond FDA2YL02 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 YL02 is a medium viscosity epoxy resin system specifically developed for adhesive and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug.. |
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| Pot Life | 180 min | 180 min | 40 grams |
| Tra-Con Tra-Bond 216E01 Non-Sag Dam Applications Adhesive TRA-BOND 216E01 is a thixotropic, two-part adhesive formulated specifically for applications where a high-fill, non-sag adhesive is required. TRA-BOND 216E01 works in concert with TRA-BOND 216E02 to.. |
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| Pot Life | 180 min | 180 min | 40 grams |
| Tra-Con Tra-Bond 216E02 Encapsulant for "Fill" Applications TRA-BOND 216E02 is a two-part epoxy adhesive developed specifically for underfill and encapsulating applications where the combination of excellent mechanical, thermal and electrical properties are .. |
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| Pot Life | 180 min | 180 min | |
| Tra-Con Tra-Bond RO7 Radio Opaque Epoxy Adhesive TRA-BOND RO-7 is a high viscosity epoxy resin system specifically developed for adhesive and coating applications where radio opacity is required. It can be used as an X-ray marker on in-vitro medic.. |
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| Pot Life | 180 min | 180 min | |
| Tra-Con Tra-Cast 3143 Fire Retardant Epoxy Casting Compound TRA-CAST 3143 has a low viscosity and long pot life. It is certified to the requirements of UL 94 V-O, and is recommended for rigid potting, laminating, transformer encapsulating, filament winding a.. |
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| Pot Life | 180 min | 180 min | |
| Cytec (Conap) FR-1050 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ.. |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® 353ND-T High Temperature Thixotropic Epoxy Product Description: EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. Advantages & Application Notes: Suitable for fiber op.. |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® 353ND-T1 High Temperature Thixotropic Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed for fiber optic, electronics and medical applications. It is a more viscous alternative to EPO-TEK® 353ND-T.I.. |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® 353ND-T5 High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T5 is an intermediate viscosity version of EPO-TEK® 353ND and EPO-TEK® 353ND-T. It was designed for high temperature applications in fiber optics, electronics .. |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® 354 High Temperature Epoxy Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally i.. |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® 430 Epoxy Product Description: A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding .. |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding... |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca.. |
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| Pot Life | 180 - 300 min | 180 - 300 min | |
| Abatron AboThane 8901-4 Polyurethane Enamel Clear, glossy polyurethane enamel with good chemical, weather and abrasion resistance as a clear anti-graffiti coating. High-grade, high-build, 2-component system for good performance on metal, woo.. |
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| Pot Life | 180 min | 180 min | uncured |
| Atom Adhesives AA-BOND FDA2T Epoxy Adhesive AA-BOND FDA2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received .. |
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| Pot Life | 180 min | 180 min | uncured |
| Atom Adhesives AA-DUCT 916 Epoxy Adhesive AA-DUCT 916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good elect.. |
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| Pot Life | 180 min @Temperature 100 °C |
180 min @Temperature 212 °F |
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| Abatron AboCast 8103-13 One-Component Epoxy AboCast 8103-13 is the low-viscosity one-component clear epoxy system with deep impregnation that offers high performance at relatively high temperatures. It is best for thin-wall casting. Suggested.. |
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| Pot Life | 180 min @Temperature 25.0 °C |
180 min @Temperature 77.0 °F |
200 g |
| Abatron AboCast 8110-1/AboCure 8110-2 Flexible Epoxy This epoxy system can achieve flexibility and plasticity without sacrificing adhesive, electrical, structural, and other properties. This compound is a clear (unfilled) basic formulation. Its applic.. |
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| Pot Life | 180 min @Temperature 25.0 °C |
180 min @Temperature 77.0 °F |
200 g |
| Abatron AboCast 8110-9/AboCure 50-1 Flexible Epoxy This epoxy system can achieve flexibility and plasticity without sacrificing adhesive, electrical, structural, and other properties. This compound is a clear (unfilled) basic formulation. Its applic.. |
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