Epoxy Technology EPO-TEK® H54 High Temperature Epoxy

Category	Polymer , Thermoset , Epoxy
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® H54 High Temperature Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optical industries.Advantages & Application Notes: Thixotropic nature provides a non-sag adhesive, with wet green strength prior to cure.Color change from tan to amber upon successful cure.Versatile adhesive to most plastics, ceramics, metals, and glass.Suggested Applications:PCB; Staking SMD devices to the PCB for double-sided assembly.Bonding of ferrites for power-devices.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	1.02 g/cc	1.02 g/cc	Part A
	1.12 g/cc	1.12 g/cc	Part B
Particle Size	<= 20 µm	<= 20 µm
Viscosity	9000 - 15000 cP @Temperature 23.0 °C	9000 - 15000 cP @Temperature 73.4 °F	20 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80
Tensile Modulus	3.8550 GPa	559.12 ksi	Storage
Shear Strength	13.47 MPa	1953 psi	Lap
	>= 35.2 MPa	>= 5100 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	43.0 µm/m-°C	23.9 µin/in-°F	Below Tg
	231 µm/m-°C	128 µin/in-°F	Above Tg
Maximum Service Temperature, Air	225 °C	437 °F	Continuous
	325 °C	617 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 90.0 °C	>= 194 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	399 °C	750 °F	Degradation Temperature

Electrical Properties	Metric	English
Volume Resistivity	>= 4.00e+12 ohm-cm	>= 4.00e+12 ohm-cm
Dielectric Constant	3.21 @Frequency 1000 Hz	3.21 @Frequency 1000 Hz
Dissipation Factor	0.0030 @Frequency 1000 Hz	0.0030 @Frequency 1000 Hz

Processing Properties	Metric	English	Comments
Cure Time	1.00 min @Temperature 150 °C	0.0167 hour @Temperature 302 °F	minimum
	5.00 min @Temperature 120 °C	0.0833 hour @Temperature 248 °F	minimum
	10.0 min @Temperature 100 °C	0.167 hour @Temperature 212 °F	minimum
Pot Life	180 min	180 min
Shelf Life	12.0 Month @Temperature 23.0 °C	12.0 Month @Temperature 73.4 °F

Descriptive Properties	Value	Comments
Color	Amber	Part B
	Tan	Part A
Consistency	Smooth Thixotropic paste
Mix Ratio By Weight	10:1
Number of Components	Two
Weight Loss	0.02%	200°C
	0.45%	250°C
	1.46%	300°C

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