Cytec (Conap) FR-1050 Conapoxy® Resin / Conacure® Hardener

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer	Cytec
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cytec (Conap) FR-1050 Conapoxy® Resin / Conacure® Hardener.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.Cytec (Conap) FR-1050 Conapoxy® Resin / Conacure® HardenerA low cost filled epoxy potting system. It has convenient 2 to 1 mix ratio and low viscosity.Mix Ratio, Resin/Hardener (by weight): 100/50 Cure Type: Room Temperature

Physical Properties	Metric	English	Comments
Viscosity	6000 cP @Temperature 25.0 °C	6000 cP @Temperature 77.0 °F

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	110 °C	230 °F

Electrical Properties	Metric	English
Volume Resistivity	<= 5.90e+15 ohm-cm	<= 5.90e+15 ohm-cm
Dielectric Constant	2.83 @Frequency 1000 Hz	2.83 @Frequency 1000 Hz
Dielectric Strength	13.8 kV/mm	350 kV/in
Dissipation Factor	0.011 @Frequency 1000 Hz	0.011 @Frequency 1000 Hz

Processing Properties	Metric	English
Cure Time	960 min @Temperature 60.0 °C	16.0 hour @Temperature 140 °F
	4320 - 7200 min @Temperature 25.0 °C	72.0 - 120 hour @Temperature 77.0 °F
Pot Life	180 min	180 min

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