Polymer Property : Pot Life = 1440 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	1440 min	1440 min
NextGen Adhesives P907-30 Optical Assembly Adhesive Description: NGAC P907-30 is a high viscosity, controlled flow encapsulant designed for microelectronics applications requiring low shrinkage and high reliability performance.Advantages and Applicat..
Pot Life	1440 min	1440 min
Resin Technology Group 405 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life	1440 min	1440 min
Resin Technology Group TIGA 905 One-Part Silver Conductive Epoxy System Cure 6 minutes at 130°C or 3 minutes at 150°C.TIGA 905 is a stress-absorbing and electrically conductive, silver-filled epoxy adhesive recommended for solder replacement in microelectronic interco..
Pot Life	1440 - 2880 min @Temperature 25.0 Â°C	1440 - 2880 min @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ EP-809 Ignition Coil Impregnating and Encapsulation Epoxy Lord EP-809 is a long working life, heat curing, two component epoxy formulation. It was designed especially for potting high voltage automotive ignition coils. The combination of low viscosity, exc..
Pot Life	1440 min @Temperature 25.0 Â°C	1440 min @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-430 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with ..
Pot Life	1440 min @Temperature 25.0 Â°C	1440 min @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi..
Pot Life	>= 1440 min	>= 1440 min	100 gram batch
Master Bond EP45HTMED Epoxy Resists Radiation and Steam Sterilization Description: Master Bond Polymer System EP45HTMED is a two component heat cured epoxy system for high performance structural bonding, sealing, coating and casting. It is especially designed for the ..
Pot Life	>= 1440 min	>= 1440 min	100 gram batch
Master Bond EP46HT-2Med Two Component Heat Resistant Biocompatible Epoxy System Master Bond Polymer System EP46HT-2MED is a two component medical grade epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures fr..
Pot Life	1440 min @Temperature 25.0 °C	1440 min @Temperature 77.0 °F	(1 day)
Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the..
Pot Life	1440 min	1440 min	(1 day)
Tra-Con Tra-Bond 2212 High Temperature Epoxy Adhesive TRA-BOND 2212 was developed for high temperature bonding, laminating, filament winding and potting applications where the combination of good physical and mechanical properties plus superior wetting..
Pot Life	>= 1440 min @Temperature 25.0 °C	>= 1440 min @Temperature 77.0 °F	100 grams
Trelleborg Emerson & Cuming Eccobond® 17 M 1 Heat Cure Catalyst Emerson & Cuming 17 M 1 Eccobond® Heat Cure CatalystVery high temperature resistance, highest temperature strength, lowest shrink. Non-crystallizing. Long working life. Imparts excellent chemical r..
Pot Life	>= 1440 min @Temperature 25.0 °C	>= 1440 min @Temperature 77.0 °F	100 grams
Trelleborg Emerson & Cuming Eccobond® B 97 Heat Cure Catalyst Emerson & Cuming B 97 Eccobond® Heat Cure CatalystVery high temperature resistance, not as brittle as 17 M 1. Cures from 80°C to 200°C. Excellent chemical resistance. May also be used as an accel..
Pot Life	1440 min	1440 min
Dow Corning HM-2500 CLEAR ASSEMBLY SEALANT A reactive Hot Melt silicone sealant that has immediate strength and crosslinks into a neutral cure RTV sealantInformation provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® 591 LSR PART A&B 50 Durometer, 2-part, 1 to 1 mix, off-white, Liquid Silicone Rubber, for insulating sleeve and printing roller appliacations.Information provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® 94-599-HC SILICONE RUBBER PART A&B 47 Durometer, 2-part, 1 to 1 mix, translucent, molding grade, Liquid Silicone Rubber.Information provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® LSR 9451-1000P 30 Durometer, 2-part, 10 to 1 mix, translucent, Fabric Coating grade, Liquid Silicone RubberInformation provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® LSR 9791-70 A&B KIT 70 Durometer, 2-part, 1 to 1 mix, translucent, molding grade, Liquid Silicone Rubber.Information provided by Dow Corning
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® 323LP Epoxy Material Description: Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.Information Provided by Epoxy Technology
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® 377 High Temperature Epoxy Product Description: EPO TEK®377 is a two component, high Tg, fiber optic grade epoxy adhesive. It is well suited for semiconductor, medical and optical applications.Advantages & Application Notes:..
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f..
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N..
Pot Life	1440 min	1440 min
Dow Corning 3625 A&B KIT A 2 part solventless liquid silicone rubber that is both hard and heat stable. Shows particularly good adhesion to polyamide as well as glass and has a flexible low friction and non-blocking surface..
Pot Life	1440 min @Temperature 23.0 °C	1440 min @Temperature 73.4 °F
Loctite® 3889 Rapid Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..