Aptek 2100-A7C/B Low modulus urethane staking compound

Category	Polymer , Adhesive , Thermoset , Polyurethane, TS , Thermoset Polyurethane, Adhesive
Manufacturer	Aptek Laboratories
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Aptek 2100-A7C/B Low modulus urethane staking compound.pdf
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Material Notes:

APTEK 2100-A7C/B is a thixotropic, two component, electrically insulating, low modulus urethane system designed for the staking of electrical/electronic components to printed circuit boards. Although APTEK 2100-A7C/B is capable of achieving full cure at room temperature, a short term exposure to moderate heat will greatly reduce processing time and optimize cured properties.100% solids, solvent free system that will not form voids during cure or service life; Low Tg for excellent low-temperature cycling and performance; Very good substrate adhesion, superior to silicones; Exceeds NASA outgassing requirements for high vacuum environmentsAPTEK 2100-A7C is a translucent, filled polyol resin. APTEK 2100-B is a yellow/orange, organic isocyanate.Information provided by Aptek Laboratories, Inc.

Physical Properties	Metric	English	Comments
Density	0.990 g/cc	0.0358 lb/in³	A Component; ASTM D1475
	1.21 g/cc	0.0437 lb/in³	B Component; ASTM D1475
Viscosity	35 cP	35 cP	B Component; ASTM D1824
Outgassing - Total Mass Loss	0.38 %	0.38 %	Cured property; at 10E-6 torr; ASTM E-595
Collected Volatile Condensable Material	0.030 %	0.030 %	Cured property; at 10E-6 torr; ASTM E595

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	55	55	Cured property; ASTM D2240
Tensile Strength, Ultimate	2.76 MPa	400 psi	Cured property; ASTM D412
Elongation at Break	265 %	265 %	Cured property; ASTM D412

Thermal Properties	Metric	English	Comments
CTE, linear	79.0 µm/m-°C @Temperature 20.0 °C	43.9 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 1; JMTP P200
	185 µm/m-°C @Temperature 20.0 °C	103 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 2; JMTP P200
Glass Transition Temp, Tg	-70.0 °C	-94.0 °F	Cured property; JMTP 200
Flash Point	>= 150 °C	>= 302 °F	A Component; ASTM D92
	>= 150 °C	>= 302 °F	B Component; ASTM D92

Electrical Properties	Metric	English	Comments
Volume Resistivity	5.30e+15 ohm-cm	5.30e+15 ohm-cm	Cured property; ASTM D257
Dielectric Constant	3.5 @Frequency 1000 Hz	3.5 @Frequency 1000 Hz	Cured property; ASTM D150
Dielectric Strength	>= 14.2 kV/mm	>= 360 kV/in	Cured property; 0.1 inch; ASTM D149
Dissipation Factor	0.030 @Frequency 1000 Hz	0.030 @Frequency 1000 Hz	Cured property; ASTM D150

Processing Properties	Metric	English	Comments
Processing Temperature	80.0 °C	176 °F	Cure 5 hrs + 2 hrs at RT
	100 °C	212 °F	Cure 3 hrs + 2 hrs at RT

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