Material Notes:
APTEK 6506-PMF is a one component, 100% solid, mineral-filled epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards as well as a protective barrier underneath epoxy overmolded devices. APTEK 6505-PMF displays excellent adhesion to various metal, ceramic, and PC board substrates.Long RT pot life/snap heat cure-ideal for automated systems; High purity resin system for minimum level of ionic contamination to prevent corrosion problems; Smooth, highly thixotropic consistency for machine stamping and syringe dispensing applications. Holds its shape during heat cure for component stacking applications; Capable of cure at 80ºC to minimize harmful heat-sensitive components; Changes colors when gelation occurs-takes the guess work out of knowing when the material is gelled; Lower Tg version available in various size syringes and alternative containers to meet application requirementsInformation provided by Aptek Laboratories, Inc.