Polymer Property : Thermal Conductivity = 6.94 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	1.00 - 2.00 W/m-K	6.94 - 13.9 BTU-in/hr-ft²-°F	Through Plane; ASTM E1461
PolyOne Trilliant™ HC HC0200-5001 XR Grey Thermoplastic Elastomer (TPE) The Trilliant® specialty compounds offer a complete system of specialty engineered materials, certified processes, services and technical support that enable healthcare OEM's to get to market ahead..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	ASTM D5470
Parker Chomerics THERM-A-GAP™ G174 Cost Effective Gap Filler Description: THERM-A-GAP™ elastomers are used to fill air gaps between PC boards or other components and heat sinks, metal enclosures, and chassis. The exceptional conformability of these advanced ..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	through-plane, 10103mm sample; ASTM E 1461-07
SABIC Innovative Plastics LNP KONDUIT OX11314 PPS (Asia Pacific) Thermally conductive mineral filled PPS FR compound
Thermal Conductivity	1.00 - 3.00 W/m-K @Temperature 50.0 - 100 °C	6.94 - 20.8 BTU-in/hr-ft²-°F @Temperature 122 - 212 °F	Average value: 1.94 W/m-K Grade Count:14
Overview of materials for Silicone, Molded, Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Silicone, Molded, Glass Fiber Filled". Each property range of values reported is minimum and maximum val..
Thermal Conductivity	1.00 - 3.3867 W/m-K @Temperature 50.0 - 100 °C	6.94 - 23.504 BTU-in/hr-ft²-°F @Temperature 122 - 212 °F	Average value: 2.08 W/m-K Grade Count:15
Overview of materials for Silicone Rubber This property data is a summary of similar materials in the MatWeb database for the category "Silicone Rubber". Each property range of values reported is minimum and maximum values of appropriate Ma..
Thermal Conductivity	<= 1.00 W/m-K	<= 6.94 BTU-in/hr-ftÂ²-Â°F
MarkeTech MC-LD and MC-MD Ultra High Temperature Machinable Ceramics For very high temperatures or where thermal conductivity or thermal shock is important, these machinable alkaline/alkaline earth zirconium phosphate ceramics (NaZr2P3O12 or BaZr4P6O24) are recommend..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ftÂ²-Â°F
GBC Cerasilâ„¢ 223U Ceramic Has a lower CTE, better thermal shock resistance, lower firing temperature, and lower consistent shrinkage than steatite.Applications: ideal for volume production of small pressed insulators often r..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ftÂ²-Â°F
Schott N-SF1 Glass Information Provided by SCHOTT North America, Inc.
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ftÂ²-Â°F
Schott N-SF14 Glass Information Provided by SCHOTT North America, Inc.
Thermal Conductivity	1.00 W/m-K @Temperature 121 °C	6.94 BTU-in/hr-ft²-°F @Temperature 250 °F
Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F
Trelleborg Emerson & Cuming Stycast® 4952/25 Two-Component Silicone High Service Temp Encapsulant Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	through plane; ASTM E1461
DSM Stanyl® TC153 PA46 FR(17) Thermal conductive material, Flame Retardant, Heat Stabilized
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	ASTM E1530
Eurostar Starflam RF0023E PA66/6, 10% Glass Filled, Injection Molded Starflam RF0023E is a Mineral Flame Retardant, Halogen Free and Phosphorous Free, Glass Fiber Reinforced, Polyamide 66/6 Injection Molding (also known as RF1002Z230EM)Information provided by Polymer..
Thermal Conductivity	1.00 W/m-K @Temperature 100 °C	6.94 BTU-in/hr-ft²-°F @Temperature 212 °F	Silicone Property; ASTM E1530
Arlon Thermabond® R37260N008 0.008" Uncured Silicone Rubber on Fiberglass Carrier Primerless Thermabond®: Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction:Liner: 1 mil FEPProduct: Uncured Silicone RubberCarrier: 3 m..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F
Atom Adhesives AA-BOND 2153 Epoxy Adhesive AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits..
Thermal Conductivity	1.00 W/m-K @Pressure 2.07 MPa	6.94 BTU-in/hr-ft²-°F @Pressure 300 psi	ASTM D5470
Parker Chomerics CHO-SEAL® 6502 Conductive Elastomer Description: Highest performance in harsh environments; excellent shielding; best choice for corrosion requirements against aluminum.Molded and ExtrudedRoHS CompliantInformation provided by Chomeric..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F
Resinlab® EP1285HD-14 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..