Polymer Property : Thermal Conductivity = 6.94 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	1.00 - 2.00 W/m-K	6.94 - 13.9 BTU-in/hr-ft²-°F	Through Plane; ASTM E1461
PolyOne Trilliant™ HC HC0200-5001 XR Grey Thermoplastic Elastomer (TPE) The Trilliant® specialty compounds offer a complete system of specialty engineered materials, certified processes, services and technical support that enable healthcare OEM's to get to market ahead..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	ASTM D5470
Parker Chomerics THERM-A-GAP™ G174 Cost Effective Gap Filler Description: THERM-A-GAP™ elastomers are used to fill air gaps between PC boards or other components and heat sinks, metal enclosures, and chassis. The exceptional conformability of these advanced ..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	through-plane, 10103mm sample; ASTM E 1461-07
SABIC Innovative Plastics LNP KONDUIT OX11314 PPS (Asia Pacific) Thermally conductive mineral filled PPS FR compound
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F
Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A flame retardant, novolac-hardened epoxy molding compound recommended for semiconductor packages that are not stress sensitive.
Thermal Conductivity	<= 1.00 W/m-K	<= 6.94 BTU-in/hr-ftÂ²-Â°F
MarkeTech MC-LD and MC-MD Ultra High Temperature Machinable Ceramics For very high temperatures or where thermal conductivity or thermal shock is important, these machinable alkaline/alkaline earth zirconium phosphate ceramics (NaZr2P3O12 or BaZr4P6O24) are recommend..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ftÂ²-Â°F
Schott N-SF1 Glass Information Provided by SCHOTT North America, Inc.
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ftÂ²-Â°F
Schott N-SF14 Glass Information Provided by SCHOTT North America, Inc.
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ftÂ²-Â°F
Schott N-SF5 Glass Information Provided by SCHOTT North America, Inc.
Thermal Conductivity	1.00 W/m-K @Temperature 90.0 Â°C	6.94 BTU-in/hr-ftÂ²-Â°F @Temperature 194 Â°F
Schott Glass 8337B Borosilicate Glass Borosilicate glass for sealing to Kovar metal and tungsten, highly UV-transmitting photomultiplier and UV detectors The heavy metal content for the elements lead, cadmium, mercury, and hexavalent ..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F
Trelleborg Emerson & Cuming Stycast® 4952/25 Two-Component Silicone High Service Temp Encapsulant Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	ASTM E1530
Eurostar Starflam RF0023E PA66/6, 10% Glass Filled, Injection Molded Starflam RF0023E is a Mineral Flame Retardant, Halogen Free and Phosphorous Free, Glass Fiber Reinforced, Polyamide 66/6 Injection Molding (also known as RF1002Z230EM)Information provided by Polymer..
Thermal Conductivity	1.00 W/m-K @Temperature 100 °C	6.94 BTU-in/hr-ft²-°F @Temperature 212 °F	Silicone Property; ASTM E 1530
Arlon Thermabond® 99A30N008 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: Primerless Thermabond®: Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction: Liner: FEPProduct: Uncured Silicone Rubber Carrier..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F
Atom Adhesives AA-BOND 2153 Epoxy Adhesive AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits..
Thermal Conductivity	1.00 W/m-K @Pressure 2.07 MPa	6.94 BTU-in/hr-ft²-°F @Pressure 300 psi	ASTM D5470
Parker Chomerics CHO-SEAL® 6502 Conductive Elastomer Description: Highest performance in harsh environments; excellent shielding; best choice for corrosion requirements against aluminum.Molded and ExtrudedRoHS CompliantInformation provided by Chomeric..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® B3UGM210 GR 22866 10/50% Glass/Mineral Filled PA6 FR (Dry) Description: Halogen- and phosphorus-free injection-molding grade with very high rigidity, low smoke density and outstanding electrical properties.Information provided by BASF