Polymer Property : Thermal Conductivity = 1.50 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	1.50 - 4.69 W/m-K @Temperature 50.0 - 50.0 °C	10.4 - 32.5 BTU-in/hr-ft²-°F @Temperature 122 - 122 °F	Average value: 1.94 W/m-K Grade Count:4
Overview of materials for Silicone, Molded, Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Silicone, Molded, Glass Fiber Filled". Each property range of values reported is minimum and maximum val..
Thermal Conductivity	1.50 - 4.69 W/m-K @Pressure 30.0 - 30.0 MPa	10.4 - 32.5 BTU-in/hr-ft²-°F @Pressure 4350 - 4350 psi	Average value: 1.94 W/m-K Grade Count:4
Overview of materials for Silicone, Molded, Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Silicone, Molded, Glass Fiber Filled". Each property range of values reported is minimum and maximum val..
Thermal Conductivity	1.50 - 4.69 W/m-K @Temperature 50.0 - 50.0 °C	10.4 - 32.5 BTU-in/hr-ft²-°F @Temperature 122 - 122 °F	Average value: 2.08 W/m-K Grade Count:4
Overview of materials for Silicone Rubber This property data is a summary of similar materials in the MatWeb database for the category "Silicone Rubber". Each property range of values reported is minimum and maximum values of appropriate Ma..
Thermal Conductivity	1.50 - 4.69 W/m-K @Pressure 30.0 - 30.0 MPa	10.4 - 32.5 BTU-in/hr-ft²-°F @Pressure 4350 - 4350 psi	Average value: 2.08 W/m-K Grade Count:4
Overview of materials for Silicone Rubber This property data is a summary of similar materials in the MatWeb database for the category "Silicone Rubber". Each property range of values reported is minimum and maximum values of appropriate Ma..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ftÂ²-Â°F	60Â°C for 1,000 hrs with 90% RH; JIS-R-2618
Fujipoly Industries SarconÂ® 25G-Td Thin-Film GR-TD Sarcon 25G-Td is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ftÂ²-Â°F	70Â°C for 1,000 hrs; JIS-R-2618
Fujipoly Industries SarconÂ® 25G-Td Thin-Film GR-TD Sarcon 25G-Td is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ftÂ²-Â°F	JIS-R-2618; ASTM D2326
Fujipoly Industries SarconÂ® GR-d Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ftÂ²-Â°F	60Â°C for 1,000 hrs with 90% RH; JIS-R-2618
Fujipoly Industries SarconÂ® GR-Fd Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary. GR-Fd has a mesh embedded overall.Information provided b..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ftÂ²-Â°F	JIS-R-2618; ASTM D2326
Fujipoly Industries SarconÂ® GR-HFd Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary. GR-HFd has a hardened top surface and mesh embedded over..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ftÂ²-Â°F	60Â°C for 1,000 hrs with 90% RH; JIS-R-2618
Fujipoly Industries SarconÂ® GR-HFd Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary. GR-HFd has a hardened top surface and mesh embedded over..
Thermal Conductivity	1.50 W/m-K @Temperature 90.0 Â°C	10.4 BTU-in/hr-ftÂ²-Â°F @Temperature 194 Â°F	DIN 51936, ASTM E 1461-01
Schott NextremaÂ® 712-6 Glass Ceramic The NEXTREMAÂ® family of glass-ceramics combines the glossy appearance of glass with exceptional thermal, chemical, optical and mechanical properties such as:Very low coefficient of linear thermal..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F
CeramTec ALUTIT® S Aluminum Titanate (Strength Optimized) ALUTIT®, which is produced in a special reaction-sintering process, consists of high-purity aluminum oxide and titanium oxide. It offers excellent resistance to sudden changes in temperature, good ..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F
Tra-Con Tra-Duct 2916 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good ele..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el..
Thermal Conductivity	1.50 W/m-K @Pressure 30.0 MPa, Temperature 50.0 °C	10.4 BTU-in/hr-ft²-°F @Pressure 4350 psi, Temperature 122 °F	Product Property; Arlon SQA-TMS-054
Arlon Thermabond® 48A51X015 0.015" (0.381 mm) Uncured Silicone Rubber with Fiberglass Substrate Description: Primerless Thermabond® Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction: Liner 1: Polyethylene Side 1: Uncured Silicone Rubb..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F	Silicone Property; ASTM E 1530
Arlon Thermabond® R36300W008 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: Low Outgassing, Thermally Conductive, Electrically Insulating, Thermabond® Bonds without primerRecommended Primers: Dow Corning S2260Design/Construction: Liner: FEP Product: Uncured S..
Thermal Conductivity	1.50 W/m-K @Temperature 20.0 - 100 °C	10.4 BTU-in/hr-ft²-°F @Temperature 68.0 - 212 °F
Anderman Ceramics EM60P Sillimanite Porous synthetic mullite with high thermal shock. Available as tube up to 10 ft (3 m) long with diameters 0.6" to 2.4".Information provided by Anderman Ceramics.
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F
Atom Adhesives AA-DUCT 2924 Epoxy Adhesive AA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage; low resistivity bonding applications where good electrical and physical properties over a wide temperature..
Thermal Conductivity	1.50 - 3.00 W/m-K	10.4 - 20.8 BTU-in/hr-ft²-°F	in "c" direction
Momentive Performance Materials Pyrolytic Boron Nitride (PBN) Coating High temperature protective coating for graphite.PBN has become the material of choice for compound semiconductor crystal growth and wafer processing. PBN coatings also seal and protect graphite fr..