Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive

TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of silver filled epoxy is free of solvents and copper or carbon additives. It develops strong durable electrically and thermally conducting bonds and coatings between a number of materials such as metals, ceramics, glass and plastic laminates. TRA- DUCT 2956 cures at room temperature, which makes it extremely useful for bonding heat sensitive components where hot-soldering is impractical. Other common uses include the assembly and repair of electrical modules, printed circuits, wave guides, flat cable and high frequency shields. It is an excellent product for dot dispensing through needles as small as 6 mils. Information provided by Tra-Con Inc.