Polymer Property : Thermal Conductivity = 1.30 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	1.30 W/m-K	9.02 BTU-in/hr-ft²-°F
Permabond ES578 Epoxy Resin PERMABOND® ES578 is a single-part heat cured epoxy adhesive with excellent adhesion to metal surfaces, ceramics as well as composite materials. ES578 provides excellent thermal conductivity and bon..
Thermal Conductivity	1.30 W/m-K	9.02 BTU-in/hr-ft²-°F	in-plane, ø80*3mm discs; ISO 22007-2
SABIC Innovative Plastics LNP KONDUIT PX11311 PA 6 (Europe-Africa-Middle East) Thermally conductive mineral and glass fiber filled PA6 Eco-FR compound
Thermal Conductivity	1.30 W/m-K	9.02 BTU-in/hr-ft²-°F	In-Plane; ASTM E-1461
Victrex® APTIV® 1103-050 Polyetheretherketone (PEEK) Polymer Film, Semi-Crystalline, Mineral Filled (Unve Description: APTIV® 1100 series films are the mineral filled semi-crystalline films made from VICTREX® PEEK polymer. The film provides a material solution for engineers in ultra-high performance a..
Thermal Conductivity	1.30 W/m-K	9.02 BTU-in/hr-ft²-°F	In-Plane; ASTM E1461
Victrex® APTIV® 1103-050M Polyetheretherketone (PEEK) Polymer Film, Semi-Crystalline, 30% Mineral Filled Description: APTIV® 1100 series films are the mineral filled semi-crystalline films made from VICTREX® PEEK polymer. The film provides a material solution for engineers in ultra-high performance a..
Thermal Conductivity	1.30 W/m-K	9.02 BTU-in/hr-ft²-°F	Average; ISO/CD 22007-4
Victrex® WG101™ Polyaryletherketone Product Description: High performance thermoplastic material, PolyArylEtherKetone (PAEK), semi crystalline, black, granules for injection moulding, easy flow with wear additivesWG101 does not contai..
Thermal Conductivity	1.30 W/m-K	9.02 BTU-in/hr-ft²-°F	Average; ISO/CD 22007-4
Victrex® WG102™ Polyaryletherketone Product Description: High performance thermoplastic material, PolyArylEtherKetone (PAEK), semi crystalline, granules for injection moulding, standard flow, FDA food contact compliantWG102 does not c..
Thermal Conductivity	1.30 W/m-K	9.00 BTU-in/hr-ftÂ²-Â°F	ASTM C177
Techmer ES HiFillÂ® PP 0123 C Polypropylene Availability: North AmericaForms: PelletsFeatures: Copolymer and Thermally ConductiveInformation provided by TP Composites, Inc.
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP112FLAO-1 Toughened, Two component, Heat Curing Epoxy Master Bond EP112FLAO-1 is a toughened two component, high performance epoxy resin system featuring very good temperature resistance, fine thermal conductivity and electrical insulation values with ..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP30AOHT Dimensionally Stable, Two Component Epoxy Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapi..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP45HTAO Heat Resistant Epoxy for Structural Bonding Description: Master Bond Polymer Compound EP45HTAO is a two component thermally conductive epoxy compound for high performance structural bonding, and casting. It is suitable for applications where ..
Thermal Conductivity	1.30 W/m-K	9.00 BTU-in/hr-ft²-°F
Master Bond EP76M-1R Nickel Conductive Epoxy Adhesive Description: Master Bond Polymer System EP76M-1R is a two component, nickel filled, electrically conductive adhesive for high performance bonding formulated to cure at room temperature or more rapid..
Thermal Conductivity	1.30 W/m-K	9.00 BTU-in/hr-ft²-°F
Master Bond EP79 Two Component, Silver Coated, Nickel Filled Conductive Epoxy Master Bond Polymer System EP79 is a two component, silver coated, nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or ..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond FLM36 B-staged film for high performance bonding and sealing Master Bond FLM36 is a film adhesive with exceptional strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. Based on the Master ..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond Supreme 10AOHT-LO High Shear and Peel Strength Epoxy Description: Master Bond Supreme 10AOHT-LO has a combination of properties consisting of excellent thermal conductivity, superior electrical insulation, great adhesion to a wide variety of substrate..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP42HT-2AO-1 Two Part, Cryogenically Serviceable Epoxy Description: Master Bond EP42HT-2AO-1 Black is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material that meets NASA low outgassing specifications. It featu..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond Supreme 11AOHTLO Epoxy Passes NASA Low Outgassing Tests Description: Master Bond Supreme 11AOHTLO is a two component epoxy resin system for high performance bonding and sealing. Although, it is formulated to cure at room temperature, the best cure schedu..
Thermal Conductivity	1.30 W/m-K	9.02 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® T7109-19 Electrically Insulating Epoxy Paste Material Description: A flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is an alternative to EPO-TEK® T7109-17, de..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat..