Polymer Property : Thermal Conductivity = 0.400 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	ISO 52612
Murtfeldt Original Material ”S”® Green Polyethylene Material ”S”® is based on virgin, ultrahigh molecular weight low pressure polyethylene and significantly exceeds the requirements of DIN 16972. In particular, Material ”S”® green has excellen..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F
Pyrotek Pyloric 100 High-Temperature Product for Cooking Ovens Pyrorock 100 is a refractory material used as a thermal transfer media in deck-type cooking ovens. Using our patented Isomag® process, mineral materials are combined with an inorganic binder. Thi..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F
Quadrant EPP Cesticolor™ HD 500 Polyethylene Data provided by Quadrant Engineering Plastic Products for polymers in their European product line.
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F
Quadrant EPP Cestilene™ HD 500 R Polyethylene Data provided by Quadrant Engineering Plastic Products for polymers in their European product line.
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F
Quadrant EPP TIVAR® Oil Filled PE-UHMW + oil (ISO Data) TIVAR Oil Filled is a self-lubricating PE-UHMW material in the real meaning of the word. Next to an enhanced wear resistance, the incorporated and evenly dispersed oil renders this material a consid..
Thermal Conductivity	0.400 - 0.600 W/m-K	2.78 - 4.16 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group 4554 Silicone Glass fiber reinforced silicone molding compound. Excellent thermal stability - up to 300°C, exceptional electrical properties, good mechanical strength, very good dimensional stability. Processi..
Thermal Conductivity	0.400 - 0.600 W/m-K	2.78 - 4.16 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group DECAL® 572R Phenolic Glass-fiber reinforced phenolic molding compound. Exceptional heat resistance with regard to maintaining surface finish and mechanical properties, outstanding mechanical properties, excellent rotati..
Thermal Conductivity	0.400 - 0.600 W/m-K	2.78 - 4.16 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group EPOXIDUR® 3585 EP Epoxy, Molded, Glass Fiber Filler Glass-fiber reinforced and inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures, excel..
Thermal Conductivity	0.400 - 0.500 W/m-K	2.78 - 3.47 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group MELOPAS® 6605 MP Melamine Cellulose reinforced Melamine molding compound. Very good electrical properties, excellent surface hardness, good mechanical strength and heat resistance, good wear and UV-stability, good gliding be..
Thermal Conductivity	0.400 - 0.500 W/m-K	2.78 - 3.47 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group MELOPLAS® 150 MF Wood flour-reinforced MF molding compound in dark colors. High surface hardness, high mechanical strength, good electrical properties. Self-extinguishing (V-O/1,6 according to UL 94), UL-listed. Fr..
Thermal Conductivity	0.400 - 0.500 W/m-K	2.78 - 3.47 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group MELOPLAS® 181.5 MF Cellulose-reinforced, phenol-modified MF molding compound (MPF) in white and colored shades. Very good electrical properties, high surface hardness, good mechanical strength, high UV and heat resis..
Thermal Conductivity	0.400 - 0.500 W/m-K	2.78 - 3.47 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group MELOPLAS® 183 MF Cellulose-reinforced and inorganically filled, phenol-modified MF molding compound (MPF) in white and colored shades. Improved dimensional stability and electrical properties as compared with MP 18..
Thermal Conductivity	0.400 - 0.500 W/m-K	2.78 - 3.47 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group MELOPLAS® 3025 MF Cellulose-reinforced and inorganically filled MF molding compound in white and colored shades. High surface hardness, good UV and heat stability, very good resistance to chemicals - also to foodstu..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	DIN 52 612
3M Dyneon™ TF 4105 PTFE 25% Glass Fiber Filled (discontinued **) Type II PTFE. Applications include valve seats, bearings, seals/gaskets, moldings, piston rings.Data provided by Dyneon.
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 1301/GF/30/TF/15/BK PPS, linear, with glass fiber and PTFE Applications: Automotive industry, textile-and office machinery, medical- and precision engineering.High continuous use and heat distortion temperature. Non flammable.High-strength and stiff parts w..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 1850/GF/30/TF/13/SI/2 PBT, with glass fiber, PTFE, lubricant modified Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Improved friction and wear behaviour. Emergency running property.High dimensionally stable prec..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 1850/GF/30/TF/13/SI/2/BK PBT, with glass fiber, PTFE, lubricant modified Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Improved friction and wear behaviour. Emergency running property.High dimensionally stable prec..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 1/CF/10/GK/20/TF/5/BK Polyamide 66, with carbon fiber, glass spheres and PTFE, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Improved friction and wear beh..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ftÂ²-Â°F	C518/C177
Saint-Gobain MeldinÂ® 2211 Bearing General Notes on Meldin 2000 Series Bearing Products:For High-Temperature, Close-Tolerance Applications. Able to withstand temperatures of 600Â°F with excursions to 900Â°F, the MedlinÂ 2000 Ser..
Thermal Conductivity	0.400 W/m-K @Temperature 100 °C	2.78 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 2482 Phenolic, Granular, Transfer Molded PLENCO 02482 is a general purpose, organic filled phenolic molding compound offering excellent mechanical strength while maintaining dielectric properties at elevated humidity levels. UL recognized ..
Thermal Conductivity	0.400 W/m-K @Temperature 121 °C	2.78 BTU-in/hr-ft²-°F @Temperature 250 °F
Tra-Con Tra-Bond Ablebond 933-1.5 Moisture Resistant Encapsulant TRA-BOND 933-1.5 electrically insulating epoxy encapsulant is formulated to provide a smooth crown over the device of wire bonds. This encapsulant provides protection from thermal and mechanical sho..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	ASTM C 177
Adamas Adalon® 415 PTFE, 10% Organic Filler Information provided by Adamas, HPM
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	Silicone Property; ASTM E 1530
Arlon Thermabond® 48991A015 0.015" (0.381 mm) Uncured Silicone Rubber with Fiberglass Substrate Description: Thermabond® G2pr - electrically insulating electronic adhesive. Bonds without primer.Design/Construction: Liner: PolyethyleneSide 1: Uncured Silicone RubberSubstrate: Style 1080 Fiberg..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® B3UG4 BK 23215 20% Glass Filled PA66 FR (Dry) Description: Halogen-free and phosphorus free flame retardant injection-molding grade with outstanding free-flow properties, good electrical properties and low smoke density; resistant to glow wire..
Thermal Conductivity	0.400 - 0.600 W/m-K	2.78 - 4.16 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group DECAL® 152CL Phenolic Glass-fiber and mineral reinforced phenolic molding compound. Excellent heat resistance, low mould shrinkage and post-shrinkage, good chemical resistance and mechanical properties. This product meet..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	Average value: 0.400 W/m-K Grade Count:3
Overview of materials for Polybutylene Terephthalate (PBT), Glass Fiber + PTFE Filled This property data is a summary of similar materials in the MatWeb database for the category "Polybutylene Terephthalate (PBT), Glass Fiber + PTFE Filled". Each property range of values reported is ..
Thermal Conductivity	0.400 W/m-K	2.78 BTU-in/hr-ft²-°F	Silicone Property; ASTM E 1530
Arlon R36601A010 0.010" (0.254 mm) Uncured Silicone Rubber with Fiberglass Substrate Description: Generation II Thermabond® NP electrically insulating electronic adhesive. Bonds without primer.Design/Construction: Liner 1: Polyethylene Side 1: Uncured Silicone Rubber Substrate: Sty..