Polymer Property : Thermal Conductivity = 0.190 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 104R PC (Asia Pacific) LEXAN 104R is a high viscosity multi purpose grade. FDA food contact compliant in limited colors. Effective January 15th, 2007 this grade is no longer supported with biocompatibility information a..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 124 PC UL rated HB as of 10/97. 200 series recommended when V-2 rating required. 17.5 MFR, for small, intricate parts. FDA food contact compliant in limited colors.Effective January 15th, 2007 this grade..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 124R PC UL rated HB. 200 series recommended when V-2 rating required. 17.5 MFR, for small, intricate parts. FDA food contact compliant in limited colors. Effective January 15th, 2007 this grade will no l..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 131 PC Nonhalogenated. 3.5 MFR.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 153R PC Nonhalogenated. 2.5 MFR. Blowmolding/extrusion. UV-stabilized. Internal mold release.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 920 PC (Asia Pacific) Opaque colors, low viscosity, superior flame retardance.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond F202 Anaerobic Retainer The unique 'toughening' process incorporated into Permabond® F202 gives this anaerobic adhesive excellent resistance to peel and impact forces. Primarily designed for use on metal surfaces, it is a..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond HL138 Anaerobic Retaining Compound Permabond® HL138 is a single component liquid that cures only when in contact with metal parts and oxygen is excluded. The liquid adhesive fills the “air space” between parts and upon cure which ..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond HM162 Anaerobic Retainer Permabond® HM162 is a medium viscosity retaining compound that cures when confined between metal parts to form an extremely tough bond. It is best suited for cylindrical parts and where high temper..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond LH056 Anaerobic Threadsealant Permabond LH056 is a thread sealant designed for use in sealing metal pipes and fittings in sprinkler systems which may also contain CPVC piping. Permabond LH056 prevents leaks even on pipes that ar..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® HPS1S PC High flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, e-beam and gamma sterilizable. Contains..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C 177
SABIC Innovative Plastics Lexan® HPS2S PC Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, steam, e-beam, and gamma steriliza..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Eastman Eastar GN101 PETG Copolyester (discontinued **) ISO data as provided by the manufacturer, Eastman Chemical
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® HP6NR PC Low/med flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains no ..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ftÂ²-Â°F	ASTM C 177
SABIC Innovative Plastics Ultem DH1004F PEI (Asia Pacific) High Temperature, Transparent, Polyetherimide Blend with Improved Ductility and Enhanced Hydrostability. US FDA and EU Food Contact compliant.This data was supplied by SABIC-IP for the Asia Pacific ..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ftÂ²-Â°F	ISO 8302
SABIC Innovative Plastics XenoyÂ® 6370 PBT+PC (Europe-Africa-Middle East) XENOY 6370 is an impact modified semi-crystalline thermoplastic. blend with 30% glass fibre reinforcement offering toughness and ductility.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ftÂ²-Â°F	ASTM C177
SABIC Innovative Plastics ULTEM 9090 PEI (Europe-Africa-Middle East) Polyetherimide Blend with improved Ductility and Detergent resistance. Meets FAR 25.853 and OSU 55/55 heat release and provides low toxicity, smoke and flame evolution.
Thermal Conductivity	0.190 - 0.220 W/m-K	1.32 - 1.53 BTU-in/hr-ft²-°F	ASTM C177
CPC - Vycom FLAMETEC™ KYTEC® PVDF Kytec® PVDF, the homopolymer of 1, 1-difluoroethene, is a tough engineering thermoplastic that offers a unique balance of properties. Kytec has the characteristic stability of fluoropolymers when e..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Dow SiLK™ I 130 Semiconductor Dielectric Resin SiLK™ I 130 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 130 is compatible with..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Dow SiLK™ I 1500 Semiconductor Dielectric Resin SiLK™ I 1500 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1500 is compatible wi..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Dow SiLK™ I300 140 Semiconductor Dielectric Resin SiLK™ I300 140 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 140 is compatibl..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C 177
Adamas Lakinor® U PVDF Information provided by Adamas, HPM
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
Solvay Specialty Polymers Solef® 11008 PVDF Copolymer (discontinued **) Key features of this grade: Low Viscosity, Wire & Cable, Plenum, Formulated. Recommended processing is extrusion. Available as powder & granules.General information about SOLEF® PVDF: SOLEF® PVD..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond A011 Anaerobic Threadlocker Permabond® A011 is an anaerobic adhesive designed for locking and sealing threaded or coaxially fitting metal parts where subsequent dismantling is required. Its controlled strength ensures fatigue..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 103R PC UL rated HB as of 10/97. 200 series recommended when V-2 rating required. Nonhalogenated. 7.0 MFR, for thicker sections without sinks. UV Stabilized for outdoor and lighting. Internal mold release...
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	Cenco test
PolyOne Edgetek® MP-30GF/000 Modified PPO - 30% Glass Fiber Reinforced (discontinued **) Data provided by PolyOne.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	Average value: 0.190 W/m-K Grade Count:6
Overview of materials for Acrylic, Cast This property data is a summary of similar materials in the MatWeb database for the category "Acrylic, Cast". Each property range of values reported is minimum and maximum values of appropriate MatW..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
Permabond A126 Anaerobic Retainer Permabond® A126 is a high-strength anaerobic adhesive for permanent assembly of coaxial assemblies or threaded metal components. The exceptionally low viscosity of this product makes it ideal for u..
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® 950 PC (Asia Pacific) Opaque colors, high viscosity, superior flame retardance.
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F	ASTM C177
SABIC Innovative Plastics Lexan® HP4NR PC (Europe-Africa-Middle East) Medium flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains no m..