| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | ASTM C177 |
|
SABIC Innovative Plastics Lexan® 104R PC
UL rated HB. 200 series recommended when V-2 rating required. 7.0 MFR, for thicker sections without sinks. Internal mold release. FDA food contact compliant in limited colors.Effective January 15..
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | ASTM C177 |
|
SABIC Innovative Plastics Lexan® 131 PC (Asia Pacific)
Nonhalogenated. 3.5 MFR.
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | ASTM C177 |
|
SABIC Innovative Plastics Lexan® 131R PC (Asia Pacific)
Nonhalogenated. 3.5 MFR.
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | ASTM C177 |
|
SABIC Innovative Plastics Lexan® 153R PC
Nonhalogenated. 2.5 MFR. Blowmolding/extrusion. UV-stabilized. Internal mold release.
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | ASTM C177 |
|
SABIC Innovative Plastics Lexan® 920 PC (Asia Pacific)
Opaque colors, low viscosity, superior flame retardance.
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | ASTM C177 |
|
SABIC Innovative Plastics Lexan® HP2C PC (Asia Pacific)
Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains m..
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | |
|
Permabond HM163 Anaerobic Retainer
Permabond® HM163 is a medium viscosity, thixotropic anaerobic retaining compound that cures when confined between metal parts to form a tough bond. It has been specifically formulated to provide a ..
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | |
|
Permabond LH050P Pure Anaerobic Threadsealant
PERMABOND® LH050 PURE anaerobic pipe sealant is single component paste that cures only when in contact with metal parts and oxygen is excluded. The sealant fills up the entire space between male an..
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | ASTM C177 |
|
SABIC Innovative Plastics Lexan® 143 PC
UL rated HB as of 10/97. 200 series recommended when V-2 rating required. Nonhalogenated. 10.5 MFR. UV-stabilized.
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | ASTM C177 |
|
SABIC Innovative Plastics Lexan® 920A PC (Asia Pacific)
Low viscosity injection moldable, flame retardant PC. Exceptional surface appearance. Clear, tints and opaque colors.
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | ASTM C177 |
|
SABIC Innovative Plastics Lexan® 943 PC (Asia Pacific)
Opaque colors, medium viscosity, superior flame retardance. UV-stabilized.
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | ASTM C177 |
|
SABIC Innovative Plastics Lexan® HP1 PC
High flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO sterilizable. Contains mold release.
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | |
|
Permabond MM115P Pure Anaerobic Threadlocker
Permabond® MM115 PURE Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking metal bolts, nuts and screws that may require disassembly for service and mainten..
|
|||
| Thermal Conductivity | 0.190 - 0.220 W/m-K | 1.32 - 1.53 BTU-in/hr-ft²-°F | ASTM C177 |
|
Solvay Specialty Polymers Hylar® MP10 PVDF Polyvinylidene Fluoride
(discontinued **)
Data provided by the manufacturer.Hylar® polymers have the characteristic stability of fluoropolymers combined with a unique polarity that influences its solubility and electrical properties. In a..
|
|||
| Thermal Conductivity | 0.190 - 0.250 W/m-K | 1.32 - 1.74 BTU-in/hr-ft²-°F | Average value: 0.238 W/m-K Grade Count:11 |
|
Overview of materials for Fluorinated Ethylene Propylene (FEP), Molded/Extruded
This property data is a summary of similar materials in the MatWeb database for the category "Fluorinated Ethylene Propylene (FEP), Molded/Extruded". Each property range of values reported is minimu..
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | ASTM C177 |
|
SABIC Innovative Plastics ULTEM HU1004 PEI (Europe-Africa-Middle East)
High Temperature, Transparent, Polyetherimide Blend with Improved Ductility and Enhanced Hydrostability. Healthcare management of change, biocompatible (ISO 10993 or USP Class VI) and FDA and EUFC f..
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | |
|
Eastman Drystar 0113 Copolyester
This product-line is designed to meet the needs of converters seeking value-added solutions to their drying requirements of copolyesters. Eastman’s copolyesters are highly valued for their excellen..
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | ASTM C177 |
|
Eastman Eastman AP005 Copolyester
Applications:Automotive componentsBreathable filmsElectrical/electronic componentsFilm ModificationFlexible hingesHose mandrelIndustrial componentsIndustrial hoses/beltsOffice furniturePackagingPoly..
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | |
|
Dow SiLK™ I 1500 Semiconductor Dielectric Resin
SiLK™ I 1500 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1500 is compatible wi..
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | |
|
Dow SiLK™ I 620 Semiconductor Dielectric Resin
SiLK™ I 620 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 620 is compatible with..
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | of melt |
|
DuPont Performance Polymers Zytel® 158L NC010 Nylon 612
(Unverified Data**)
Unreinforced Polyamide 612Information provided by DuPont Performance Polymers
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | |
|
Dow SiLK™ I300 140 Semiconductor Dielectric Resin
SiLK™ I300 140 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 140 is compatibl..
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | ASTM C 177 |
|
Adamas Lakinor® U PVDF
Information provided by Adamas, HPM
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | silicone property; Arlon SQA-TMS-022 |
|
Arlon 25188T017 Silicone Rubber/Laminated ETFE Film
Liner: 3 mil PTFE coated fiberglass; Side 1: uncured silicone rubber; Substrate: laminated ETFE film, treated for adhesion
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | ASTM C 177 |
|
Adamas Adalon® 451 PTFE, organic filler
Information provided by Adamas, HPM
|
|||
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | Average value: 0.190 W/m-K Grade Count:4 |
|
Overview of materials for Acrylic, Extruded
This property data is a summary of similar materials in the MatWeb database for the category "Acrylic, Extruded". Each property range of values reported is minimum and maximum values of appropriate ..
|
|||