- HOME
- POLYMER SEARCH
- Polymer Property : CTE, linear = 83.3 µin/in-°F
Polymer Property : CTE, linear = 83.3 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | ASTM E831 |
| Parker Chomerics THERM-A-FORM 1641 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
|||
| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | ASTM E831 |
| Parker Chomerics THERM-A-GAP™ GEL 8010 High Performance Fully Cured Dispensable Gel Description: Parker Chomerics fully cured dispensable GELs eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) compl.. |
|||
| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Petromont 1100 High Density Polyethylene Resin Petromont HDPE 1100 is a high-density polyethylene homopolymer resin produced using the UNIPOL® Process. This multi-purpose resin is intended primarily for use in most intermittent and continuous b.. |
|||
| CTE, linear | 150 µm/m-°C @Temperature 23.0 - 100 °C |
83.3 µin/in-°F @Temperature 73.4 - 212 °F |
|
| Quadrant EPP Semitron® ESd 225 POM-C, static dissipative, extruded (ISO Data) Semitron ESd 225 is an acetal based static dissipative material ideal for material handling operations. It is also an excellent choice for fixturing used in the manufacturing of hard disk drives or .. |
|||
| CTE, linear | 150 - 180 µm/m-°C @Temperature 20.0 °C |
83.3 - 100 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Solvay Specialty Polymers Solef® 21508 PVDF Copolymer
(discontinued **) Key features of this grade: High Elongation, Wire & Cable, Plenum, Formulated. Recommended processing is extrusion. Available as powder & granules.General information about SOLEF® PVDF: SOLEF® P.. |
|||
| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | Average value: 150 µm/m-°C Grade Count:3 |
| Overview of materials for Nylon 11, Powder This property data is a summary of similar materials in the MatWeb database for the category "Nylon 11, Powder". Each property range of values reported is minimum and maximum values of appropriate M.. |
|||
| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| LyondellBasell Petrothene® KR92828 High Density Polyethylene ApplicationsPETROTHENE KR 92828 is a high molecular weight, high density polyethylene-based compound designed for use in jacketing, conduit or wire insulation. KR 92828 contains a carbon black cont.. |
|||
| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
|
| Hybrid Plastics POSS® EP 2000 Epoxy Adhesive EP2000 is a POSS® based, ultra-high temperature epoxy adhesive. The POSS® content in EP2000 offers unique properties such as high thermal stability, outstanding oxygen and chemical resistance... |
|||
| CTE, linear | 150 µm/m-°C @Temperature -30.0 - 30.0 °C |
83.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM E831 |
| A. Schulman POLYPUR™ FPU 1117 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
|||
| CTE, linear | 150 µm/m-°C @Temperature -30.0 - 30.0 °C |
83.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM E831 |
| A. Schulman POLYPUR™ FPU 1117 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
|||
| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | Above Tg |
| Tra-Con Tra-Bond 224-1 Rapid Room Temperature Cure Epoxy Adhesive TRA-BOND 224-1 room temperature curing epoxy adhesive develops structural strength rapidly. Unlike most "rapid cure" epoxies which gel in one or two minutes, TRA-BOND 224-1 adhesive exhibits a 30 mi.. |
|||
| CTE, linear | 150 µm/m-°C @Temperature -30.0 - 30.0 °C |
83.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM E831 |
| A. Schulman POLYPUR™ CB 1110 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
|||
| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
|
| Trelleborg Emerson & Cuming Stycast® 5954 Two-Component Silicone High Service Temp Encapsulant Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har.. |
|||
| CTE, linear | 150 µm/m-°C @Temperature 0.000 - 70.0 °C |
83.3 µin/in-°F @Temperature 32.0 - 158 °F |
DIN 53752 |
| Borealis RA130E-2492 Polypropylene Random Copolymer RA130E-2492 is a high molecular weight, low melt flow rate polypropylene random copolymer (PP-R) compound and is dark blue colored. Applications: domestic water, heating, relining, plumbing, and in.. |
|||
| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | ASTM D696 |
| Eastman Eastman AP005 Copolyester Applications:Automotive componentsBreathable filmsElectrical/electronic componentsFilm ModificationFlexible hingesHose mandrelIndustrial componentsIndustrial hoses/beltsOffice furniturePackagingPoly.. |
|||
| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Eastman Neostar FN005 Elastomer Neostar FN005 elastomer is a tough, clear, durable copolyester ether. It was designed for use in the profile and automotive markets, but is also used in packaging and tubing applications where tough.. |
|||
| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Eastman Neostar FN007 Elastomer Neostar FN007 elastomer is the third in Eastman’s series of tough, clear, durable copolyester ethers. Though originally designed for use in the profile and automotive markets, this innovative copol.. |
|||
| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | Above Tg |
| Epoxy Technology EPO-TEK® H61 Unfilled Epoxy Adhesive Material Description: A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of E.. |
|||
| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | ASTM D969 |
| Equate EPDA-5040 HDPE Non-Pressure Gravity Pipe Resin EPDA-5040 is a high molecular weight high density polyethylene copolymer resin designed for non-pressure gravity pipe applications. It has a good balance of flexibility, ductility, stiffness and tou.. |
|||
| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
|
| Arkema Group Rilsan® Fine Powders Grey 49 Polyamide 11 Rilsan® fine powder coatings offer weatherability, long-lasting adhesion, chalk resistance, chemical resistance to aliphatic hydrocarbons, bases, salt solutions, oils, greases and other petroleum p.. |
|||
| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
|
| Arkema Group Rilsan® Fine Powders Natural Polyamide 11 Rilsan® fine powder coatings offer weatherability, long-lasting adhesion, chalk resistance, chemical resistance to aliphatic hydrocarbons, bases, salt solutions, oils, greases and other petroleum p.. |
|||
| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
|
| Arkema Group Rilsan® Fine Powders Polyamide 11 Rilsan® fine powder coatings offer weatherability, long-lasting adhesion, chalk resistance, chemical resistance to aliphatic hydrocarbons, bases, salt solutions, oils, greases and other petroleum p.. |
|||
| CTE, linear | 150 µm/m-°C @Temperature 20.0 - 160 °C |
83.3 µin/in-°F @Temperature 68.0 - 320 °F |
Silicone Property; ASTM E 831 |
| Arlon Thermabond® 48A43X008 0.008"(0.203 mm) Cured Silicone Rubber with Fiberglass Substrate Description: Thermabond® Electrically insulating, thermally conductive, thermal interface material (TIM).Design/Construction: Side 1: Cured Silicone RubberSubstrate: Style 1080 FiberglassSide 2: Cu.. |
|||
| CTE, linear | 150 - 180 µm/m-°C @Temperature 20.0 °C |
83.3 - 100 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Solvay Specialty Polymers Solef® 20810 PVDF Copolymer
(discontinued **) Key features of this grade: Li Battery, Virgin. Recommended processing is solution. Available as powder & granules.General information about SOLEF® PVDF: SOLEF® PVDF is a fluorinated semi-crysta.. |
|||
| CTE, linear | 150 µm/m-°C @Temperature -30.0 - 30.0 °C |
83.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM E831 |
| A. Schulman POLYPUR™ CB 1110 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
|||
| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | |
| Resinlab® UR3001HP Clear Urethane Encapsulant Resinlab™ UR3001HP Clear is a clear, two component, room temperature curing urethane encapsulating system. It is designed to cure completely at room temperature. UR3001HP Clear provides excellent e.. |
|||
Copyright © lookpolymers.com All Rights Reserved