Thermal Properties | Metric | English | Comments |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Ravago Manufacturing Americas Hylon® N1033STHL Nylon 6/6 (DAM) Information provided by Ravago. |
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CTE, linear | 27.0 µm/m-°C @Temperature -40.0 - 149 °C |
15.0 µin/in-°F @Temperature -40.0 - 300 °F |
ASTM E831 |
Quadrant EPP Semitron® 420 ESd V (ASTM Product Data Sheet) |
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CTE, linear | 27.0 - 50.4 µm/m-°C | 15.0 - 28.0 µin/in-°F | Average value: 37.5 µm/m-°C Grade Count:7 |
Overview of materials for Polyamide-Imide, Molded This property data is a summary of similar materials in the MatWeb database for the category "Polyamide-Imide, Molded". Each property range of values reported is minimum and maximum values of approp.. |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Ravago Manufacturing Americas Hylon® N1013L Nylon 6/6 (DAM)
(discontinued **) Information provided by Ravago. |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Ravago Manufacturing Americas Hylon® N1013STL Nylon 6/6 (DAM)
(discontinued **) Information provided by Ravago. |
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CTE, linear | 27.0 µm/m-°C | 15.0 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 3-7088-1 Polyamide 6, with carbon fiber and glass fiber, low-warpage Applications: Automotive industry, textile machinery, apparatus- and precision engineering.Strong, stiff parts.dynamic stressElectrically conductive, suitable for continuous discharging of staticall.. |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy 13 Indium Solder Alloy Information Provided by Indium Corporation |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy® 7 In-Pb Solder Alloy Indalloy's #7, #10, #150, #204, #205 and #206 comprise a group of lead-indium solders designed to cover the temperature range of 165°C-275°C. All have the minimum gold-leaching characteristics.. |
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CTE, linear | 27.0 µm/m-°C | 15.0 µin/in-°F | Through Thickness |
GrafTech eGRAF® HITHERM™ HT-720 Graphite Made from natural graphite, eGRAF® HITHERM™ thermal interface materials are designed for use in applications requiring low contact resistance and high thermal conductivity. HITHERM™ mat.. |
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CTE, linear | 27.0 µm/m-°C | 15.0 µin/in-°F | Through-Plane |
GrafTech eGRAF® SPREADERSHIELD™ SS400 Graphite Made from flexible graphite, eGRAF® SPREADERSHIELD™ products function as both a passive heat spreader and heat shield. SPREADERSHIELD™ material can be die-cut, press-formed, or laminate.. |
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CTE, linear | 27.0 µm/m-°C | 15.0 µin/in-°F | Through-Plane |
GrafTech eGRAF® SPREADERSHIELD™ SS500 Graphite Made from flexible graphite, eGRAF® SPREADERSHIELD™ products function as both a passive heat spreader and heat shield. SPREADERSHIELD™ material can be die-cut, press-formed, or laminate.. |
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CTE, linear | 27.0 µm/m-°C | 15.0 µin/in-°F | Through-Plane |
GrafTech eGRAF® SPREADERSHIELD™ SS600 Graphite Made from flexible graphite, eGRAF® SPREADERSHIELD™ products function as both a passive heat spreader and heat shield. SPREADERSHIELD™ material can be die-cut, press-formed, or laminate.. |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy 104 Tin-Lead Solder Alloy Widely used electronic solder. Good for silver metallization. Has improved strength and fatigue propertiesInformation Provided by Indium Corporation |
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CTE, linear | 27.0 µm/m-°C | 15.0 µin/in-°F | Through Thickness |
GrafTech eGRAF® HITHERM™ HT-1205 Graphite Made from natural graphite, eGRAF® HITHERM™ thermal interface materials are designed for use in applications requiring low contact resistance and high thermal conductivity. HITHERM™ mat.. |
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CTE, linear | 27.0 µm/m-°C | 15.0 µin/in-°F | Through Thickness |
GrafTech eGRAF® HITHERM™ HT-1210 Graphite Made from natural graphite, eGRAF® HITHERM™ thermal interface materials are designed for use in applications requiring low contact resistance and high thermal conductivity. HITHERM™ mat.. |
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CTE, linear | 27.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
2.7 mm/mm; ASTM D696 |
A. Schulman POLYPUR™ FPU 1376 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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CTE, linear | 27.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
3.45 mm/mm; ASTM D696 |
A. Schulman POLYPUR™ FPU 1377 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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CTE, linear | 27.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
2.7 mm/mm; ASTM D696 |
A. Schulman POLYPUR™ FPU 1376 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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CTE, linear | 27.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
3.45 mm/mm; ASTM D696 |
A. Schulman POLYPUR™ FPU 1377 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
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Williams Advanced Alloys WS185 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
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Williams Advanced Alloys WS209 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
Longitudinal |
Goodfellow Polyaramid/Polyphenylene Sulfide Composite Sheet or Rod 25% Polyaramid fiber - PPS Matrix. Information provided by Goodfellow. |
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CTE, linear | 27.0 µm/m-°C | 15.0 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® N20E Electrically Conductive Paste Product Description: EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditi.. |
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CTE, linear | 27.0 - 93.6 µm/m-°C | 15.0 - 52.0 µin/in-°F | Average value: 70.3 µm/m-°C Grade Count:12 |
Overview of materials for Nylon 6, PTFE Filled This property data is a summary of similar materials in the MatWeb database for the category "Nylon 6, PTFE Filled". Each property range of values reported is minimum and maximum values of appropria.. |
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CTE, linear | 27.0 - 44.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.0 - 24.4 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics NORYL PX2922 PPE (Asia Pacific) GF20% FR-V0 |
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CTE, linear | 27.0 - 68.0 µm/m-°C @Temperature 125 - 175 °C |
15.0 - 37.8 µin/in-°F @Temperature 257 - 347 °F |
Average value: 37.4 µm/m-°C Grade Count:5 |
Overview of materials for Polyimide, Thermoset Film This property data is a summary of similar materials in the MatWeb database for the category "Polyimide, Thermoset Film". Each property range of values reported is minimum and maximum values of appr.. |
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CTE, linear | 27.0 - 68.0 µm/m-°C @Thickness 1.00 - 1.00 mm |
15.0 - 37.8 µin/in-°F @Thickness 0.0394 - 0.0394 in |
Average value: 37.4 µm/m-°C Grade Count:5 |
Overview of materials for Polyimide, Thermoset Film This property data is a summary of similar materials in the MatWeb database for the category "Polyimide, Thermoset Film". Each property range of values reported is minimum and maximum values of appr.. |