Thermal Properties | Metric | English | Comments |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | X; IPC-TM-650.2.4.41 |
Park Electrochemical Nelco® NX9300 PTFE Laminate, Woven-Glass Reinforced The N9000 PTFE laminate system is designed for critical microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the N9000 PTFE laminat.. |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | X; IPC-TM-650.2.4.41 |
Park Electrochemical Nelco® NX9320 PTFE Laminate, Woven-Glass Reinforced The N9000 PTFE laminate system is designed for critical microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the N9000 PTFE laminat.. |
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CTE, linear | 25.0 µm/m-°C @Temperature 23.0 - 100 °C |
13.9 µin/in-°F @Temperature 73.4 - 212 °F |
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Quadrant EPP Duratron® PBI CU60 compression moulded (ISO Data) Duratron CU60 PBI is very “clean” in terms of ionic impurity and does not outgas (except water). These characteristics make this material extremely attractive to high-tech industries such as semic.. |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 3-7234-1 Polyamide 6, with carbon fiber, electrically conducting Applications: Automotive industry, textile machinery, apparatus- and precision engineering.Strong, stiff parts.dynamic stressAntistatic.Handles, levers, rollers, body parts.Information provided by L.. |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 50/CF/10/GF/10/TF/10/BK Polycarbonate, with carbon fiber, glass fiber and PTFE Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi.. |
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CTE, linear | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
DIN 53752; ASTM D696 |
Kolon KOPET® KP133G45 FR-PET Resin KOPET® is the FR-PET which realizes the good properties and surface of injection molding with good mold process of short cooling time in low molding temperature.Good mold release, good surface of.. |
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CTE, linear | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy® 106 (Sn63) Sn-Pb Solder Alloy Standard eutectic tin-lead solder with wide application. Not recommended against silver and/or gold.Information provided by the manufacturer, Indium Corporation. |
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CTE, linear | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy 109 Tin-Lead Solder Alloy Good electrical grade solderInformation Provided by Indium Corporation |
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CTE, linear | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy 130 Tin-Lead Solder Alloy Inexpensive utility solderInformation Provided by Indium Corporation |
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CTE, linear | 25.0 - 30.0 µm/m-°C | 13.9 - 16.7 µin/in-°F | |
Master Bond EP45HTQ Quartz Filled Heat Resistant Epoxy Description: Master Bond Polymer Compound EP45HTQ is a two component quartz filled, epoxy compound for high performance structural bonding and casting. It is suitable for applications where long ter.. |
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CTE, linear | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
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Cosmic Plastics 6220F Short Glass Fiber Filled Iso Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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CTE, linear | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
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Cosmic Plastics K31 Short Glass Fiber Filled Iso Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | ISO 11359-2 |
Unitika E-RUNG60 PA66, 60% Glass Fiber Reinforced, Conditioned Information provided by Unitika Ltd. |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | ISO 11359-2 |
Unitika E-RUNG60 PA66, 60% Glass Fiber Reinforced, Dry Information provided by Unitika Ltd. |
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CTE, linear | 25.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
13.9 µin/in-°F @Temperature -22.0 - 86.0 °F |
D696 |
Zhejiang Juner 302-G30 30% Glass Fibre Reinforced, Flammable Resistant, and Low Separate Out Mode Applications: Electrons and Electricity: TV Components, Plugs of Computers, Exhaust Fans of Computers, Plugs, Sockets, Shells of Electronics, Framework of Level Output Transformers, Pipe Pedestals, .. |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | Below Tg |
Tra-Con Tra-Bond GA47-2LV Instrument Adhesive TRA-BOND GA47-2LV low viscosity adhesive is designed for guidance instrument applications. This adhesive exhibits excellent compatibility with conventional gyro flotation fluids. TRA-BOND GA47-2LV a.. |
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CTE, linear | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
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Loctite® 3565 High performance epoxy, high Tg and low CTE High Tg Underfill COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | Below Tg |
Tra-Con Tra-Bond Ablebond 481-20 B-Stageable Epoxy Adhesive Ablebond 481-20 flexible epoxy adhesive is a modification of Ablebond 481-19 adhesive. This adhesive is designed to absorb stresses between adherends with mismatched coefficients of thermal expansio.. |
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CTE, linear | 25.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
13.9 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
CP-Polymer-Technik Wellamid® 6000 MRGV 20/10 HWCP 20% Mineral and 10% Glass Fiber Nylon 6, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
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CTE, linear | 25.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
13.9 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
CP-Polymer-Technik Wellamid® 6000 MX 400 CP Combination Nylon 6, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
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CTE, linear | 25.0 µm/m-°C @Temperature 23.0 - 260 °C |
13.9 µin/in-°F @Temperature 73.4 - 500 °F |
ASTM D696 |
Daelim H&L Plavis-G40 CM 40% Graphite Filled Aromatic Polyimide Bearing Compression Molded. Plavis-G-40: Graphite 40 wt% filled, Self lubricating grade with low thermal expansion.General Plavis information for all grades:PLAVIS polyimide has nitrogen bonded to 3 carbo.. |
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CTE, linear | 25.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
13.9 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
CP-Polymer-Technik Wellamid® 6000 CF 18 HWCP 18% Carbon Fiber Nylon 6, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
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CTE, linear | 25.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
13.9 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
CP-Polymer-Technik Wellamid® 6000 GV 25 HWCP 25% Glass Fiber Nylon 6, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
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CTE, linear | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
LATI LARTON G/50 50% Glass Fiber Filled Polyphenylene sulfide (PPS)
(discontinued **) Description: Larton thermoplastics are polyphenylene sulfide (PPS) products. They are distinguished by a group of very interesting properties combined with easy moldability. Larton parts feature: ex.. |
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CTE, linear | 25.0 - 25.0 µm/m-°C @Temperature 140 - 180 °C |
13.9 - 13.9 µin/in-°F @Temperature 284 - 356 °F |
Average value: 25.0 µm/m-°C Grade Count:1 |
Overview of materials for Polysulfone, 30% Glass Fiber Reinforced This property data is a summary of similar materials in the MatWeb database for the category "Polysulfone, 30% Glass Fiber Reinforced". Specific grades with glass content between 25% and 34% are inc.. |