Thermal Properties | Metric | English | Comments |
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UL RTI, Mechanical with Impact | 150 °C | 302 °F | |
Resinoid 1340 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance |
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UL RTI, Mechanical with Impact | 150 °C | 302 °F | Average value: 150 °C Grade Count:8 |
Overview of materials for Phenolic, Novolac, Impact Grade, Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Impact Grade, Filled". Each property range of values reported is minimum and maximum .. |
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UL RTI, Mechanical with Impact | 150 °C | 302 °F | Average value: 150 °C Grade Count:6 |
Overview of materials for Phenolic, Novolac, Woodflour Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Woodflour Filled". Each property range of values reported is minimum and maximum valu.. |
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UL RTI, Mechanical with Impact | 150 °C | 302 °F | Average value: 150 °C Grade Count:4 |
Overview of materials for Phenolic, Novolac, Mineral/Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Mineral/Fiber Filled". Each property range of values reported is minimum and maximum .. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.50 mm |
302 °F @Thickness 0.0591 in |
ALL |
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U.. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.50 mm |
302 °F @Thickness 0.0591 in |
BK |
Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications.. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.50 mm |
302 °F @Thickness 0.0591 in |
(BN, BK) |
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati.. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
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Plenco 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound
(discontinued **) Plaslok 201 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to have an excellent balance of molded properties. The material provides good electrical insulation val.. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
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Plenco 204 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound
(discontinued **) Plaslok 204 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to accommodate a wide range of molding situations. In addition, it is recommended for use in thin wall .. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
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Plenco 5440 Black General Purpose Phenolic Molding Compound
(discontinued **) Plaslok 5440 is the replacement material for the former Union Carbide BMRS-5440. It is a two-stage, phenolic molding compound that has been successfully formulated to accommodate a very wide range .. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
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Plenco 7000 Black General Purpose Woodflour Filled Phenolic Molding Compound
(discontinued **) Plaslok 7000 is the replacement material for the former Union Carbide BMM-7000. It is a two-stage, woodflour-filled phenolic molding compound having versatile molding and preheating characteristics.. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
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Plenco 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound
(discontinued **)< Plaslok 504 is a two-stage, mineral and cellulose-filled phenolic molding compound having better impact and heat resistance than general purpose molding compounds. Since it also has good electrical.. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
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Plenco 506 Black Heat Resistant Mineral Filled Phenolic Molding Compound
(discontinued **) Plaslok 506 is a two-stage, mineral-filled phenolic molding compound. It is formulated for automotive ashtrays and for appliance applications such as utensil handles receiving repeated exposure to .. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
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Plenco 5314 Black (COM) Impact Grade Phenolic Molding Compound
(discontinued **) Plaslok 5314 is the replacement material for the former Union Carbide BMMA-5314. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of.. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.60 mm |
302 °F @Thickness 0.0630 in |
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Plenco 309 Black (INJ) Mineral/Fiber Filled Phenolic Molding Compound
(discontinued **) Plaslok 309 is a two-stage, mineral and fiber-filled phenolic molding compound having excellent impact strength; and as such, is considered a good candidate for replacing chopped-fiber filled compou.. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
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Plaslok 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 201 is a two-stage, woodflour and min.. |
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UL RTI, Mechanical with Impact | 150 °C | 302 °F | 1.60 mm |
Plaslok 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 309 is a two-stage, mineral and fiber.. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.60 mm |
302 °F @Thickness 0.0630 in |
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Plaslok 309 Black (INJ) Mineral/Fiber Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 309 is a two-stage, mineral and fiber.. |
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UL RTI, Mechanical with Impact | 150 °C | 302 °F | |
Haysite Ultratrac® H950 Glass Reinforced Polyester Sheet, Electrical Grade (GPO3) This new generation of high performance material meets or exceeds all requirements for NEMA GPO-2 or GPO-3. ULTRATRAC ® H950 is recognized by U.L. as a 94V-0 material and offers greater arc and t.. |
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UL RTI, Mechanical with Impact | 150 °C | 302 °F | |
Resinoid 1312 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance |
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UL RTI, Mechanical with Impact | 150 °C | 302 °F | |
Resinoid 2010 Phenolic Molding, Fabric Reinforced Data provided by the manufacturer.The Resinoid 2000 organic fiber reinforced series compounds feature mechanical strength, dimensional stability, and shock resistance |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 0.750 mm |
302 °F @Thickness 0.0295 in |
BK |
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,.. |
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UL RTI, Mechanical with Impact | 150 °C | 302 °F | 1.47 mm |
Plaslok 5440 Black General Purpose Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5440 is the replacement material for .. |
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UL RTI, Mechanical with Impact | 150 °C | 302 °F | 1.47 mm |
Plaslok 7000 Black General Purpose Woodflour Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 7000 is the replacement material for .. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
|
Plaslok 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound
(discontinued **)&l Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 504 is a two-stage, mineral and cellu.. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
|
Plaslok 306 Black General Purpose Mineral/Flock Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 306 is a two-stage, mineral and flock.. |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
|
Plaslok 5314 Black (COM) Impact Grade Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5314 is the replacement material for .. |
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UL RTI, Mechanical with Impact | 150 °C | 302 °F | |
Resinoid 7201 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance |
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UL RTI, Mechanical with Impact | 150 °C @Thickness 3.00 mm |
302 °F @Thickness 0.118 in |
ALL |
Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou.. |
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UL RTI, Mechanical with Impact | 150 °C | 302 °F | 1.57 mm |
Plaslok 204 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 204 is a two-stage, woodflour and min.. |