Plaslok 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound (discontinued **)

Category	Polymer , Thermoset , Filled/Reinforced Thermoset , Phenolic , Phenolic, Novolac, Mineral/Fiber Filled
Manufacturer
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Plaslok 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 309 is a two-stage, mineral and fiber-filled phenolic molding compound having excellent impact strength; and as such, is considered a good candidate for replacing chopped-fiber filled compounds. It has superior surface finish, and excellent molding latitude.Data provided by Plaslok Corporation.

Physical Properties	Metric	English	Comments
Density	1.46 g/cc	0.0527 lb/in³	ASTM D792
Apparent Bulk Density	0.500 g/cc	0.0181 lb/in³	ASTM D1895
Water Absorption	0.40 %	0.40 %	ASTM D570
Linear Mold Shrinkage	0.0045 cm/cm	0.0045 in/in	Compression; ASTM D955

Mechanical Properties	Metric	English	Comments
Tensile Strength, Ultimate	52.0 MPa	7540 psi	ASTM D638
Flexural Yield Strength	83.0 MPa	12000 psi	ASTM D790
Flexural Modulus	6.90 GPa	1000 ksi	ASTM D790
Compressive Yield Strength	166 MPa	24100 psi	ASTM D695
Izod Impact, Notched	0.290 J/cm	0.543 ft-lb/in	ASTM D256

Thermal Properties	Metric	English	Comments
UL RTI, Electrical	150 °C	302 °F	1.60 mm
UL RTI, Mechanical with Impact	150 °C	302 °F	1.60 mm
UL RTI, Mechanical without Impact	150 °C	302 °F	1.60 mm
Flammability, UL94	V-0	V-0	6.10 mm
	V-0	V-0	6.10 mm

Electrical Properties	Metric	English	Comments
Electrical Resistivity	2.20e+10 ohm-cm	2.20e+10 ohm-cm	ASTM D257
Dielectric Strength	12.2 kV/mm	310 kV/in	ASTM D149
Comparative Tracking Index	180 V	180 V	UL 746

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