Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | ISO 11357-1 |
Murtfeldt Murylon® HT Nylon 46 The use of this highly temperature resistant polyamide enables reliable operation up to a constant service temperature of 155°C . The material retains its rigidity and creep strength over the entir.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
Eastman EASTALLOY Polymer DA003-8999K, Clear Alloy
(discontinued **) Properties below based on a film thickness of 250 microns. CO2 Permeability is 49 cm3·mm/m2·24h·atm per ASTM D 1434.Product Description: EASTALLOY DA003-8999K Polymer is a clear copolyester/pol.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | 10°C/min; DAM; ISO 11357-1/-2 |
DuPont Performance Polymers Zytel® 70G30L NC010 Nylon 66
(Unverified Data**) Zytel® 70G30L NC010 is a 30% glass fiber reinforced polyamide 66 resin for injection molding.Information provided by DuPont Performance Polymers |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | ASTM E1640-99 (by DMA) |
Lord Adhesives 320 / 322 Epoxy Adhesive LORD® 320/322 adhesive is a general purpose, two component epoxy adhesive system formulated for primerless adhesion to automotive sheet molded compounds (SMC). This adhesive system also provides .. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | MCI Method |
Mitsui APELâ„¢ APL6509T Cyclo Olefin Copolymer (COC) This material possesses many characteristics inherent in polyolefins such as excellent electrical insulating properties and outstanding moisture resistance. In addition, it features good melt proces.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
SK Chemicals SKYGREEN® PETG 2008 Specially Formulated PET Copolymer Resin SKYGREEN PETG is an amorphous copolyester in which a certain amount of ethylene glycol is replaced with 1,4-cyclohexane dimethanol (CHDM), which prevent crystallization, leading to improved processa.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
Wanshijie PETG Sheet PETG is also named GPET. It is made of a kind of non-crystalline PET resin sourced from cyclohexanediol modification. PETG differs greatly from PET and PCT. PETG is a kind of non-crystalline copolym.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | |
Zeus FEP Tubing FEP, fluorinated ethylene propylene, is a melt processable fluoropolymer that allows for long, continuous lengths and has several distinct advantages over PTFE. Applications where FEP tubing is usua.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
Eastman Drystar 0601 Copolyester, Injection Molded This product-line is designed to meet the needs of converters seeking value-added solutions to their drying requirements of copolyesters. Eastman’s copolyesters are highly valued for their excellen.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | |
Eastman Eastar GN007 PETG Copolyester ISO data as provided by the manufacturer, Eastman Chemical |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
Eastman GSP01 Copolyester for Film and Sheet Extrusion Applications:Consumer e-packaging trayElectronic packagingElectrostatic dissipative trayProduct Description: GSP01 is a clear, amorphous material. Because of its clarity, toughness and good melt s.. |
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Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® 301-2 Optically Transparent Epoxy Product Description: EPO-TEK® 301-2 is a two component optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.Advantages & Appli.. |
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Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® EK1000-MP Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding .. |
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Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos.. |
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Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | |
Epoxy Technology EPO-TEK® M10-D Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
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Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® OM125 Optical Epoxy Product Description: EPO-TEK® OM125 is two component, high Tg, optical epoxy designed for bonding multi-mode fiber optic connectors. Advantages & Application Notes: Color coded blue for easy operat.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DAM; 10°C/min; ISO 11357-1/-2 |
DuPont Performance Polymers Zytel® 70G30L NC010 Nylon 66
(Unverified Data**) 30% Glass Reinforced Polyamide 66Zytel 70G30L NC010 is a 30% glass fiber reinforced polyamide 66 resin for injection molding.Information provided by DuPont Performance Polymers |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DAM; 10°C/min; ISO 11357-1/-2 |
DuPont Performance Polymers Zytel® 70G43HSLA BK099 Nylon 66
(Unverified Data**) 43% Glass Reinforced Heat Stabilized Polyamide 66 Zytel 70G43HSLA BK099 is a 43% glass fiber reinforced heat stabilized black polyamide 66 resin for injection molding.Information provided by DuPont .. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | |
Epoxyset Epoxibond EB-301 Low Expansion Epoxy Adhesive EB-301 is a highly filled, low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional stability .. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DAM; 10°C/min; DS; ISO 11357-1/-2 |
DuPont Performance Polymers Zytel® FR50 NC010A Nylon 66
(Unverified Data**) 25% Glass Reinforced Flame Retardant Polyamide 66 Zytel FR50 NC010A is a 25% glass fiber reinforced flame retardant polyamide 66 resin for injection molding.Information provided by DuPont Performanc.. |
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Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—250°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min |
Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J.. |
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Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a .. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | 10°C/min; DAM; ISO 11357-1/-2 |
DuPont Performance Polymers Zytel® 70G35HSLX BK357 Nylon 66
(Unverified Data**) Zytel® 70G35HSLX BK357 is a 35% glass fiber reinforced, heat stabilized, black polyamide 66 for injection molding.Information provided by DuPont Performance Polymers |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | 10°C/min; DAM; ISO 11357-1/-2 |
DuPont Performance Polymers Zytel® 70G43HSLA BK099 Nylon 66
(Unverified Data**) Zytel® 70G43HSLA BK099 is a 43% glass fiber reinforced, heat stabilized, black polyamide 66 resin for injection molding.Information provided by DuPont Performance Polymers |