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Polymer Property : Glass Transition Temp, Tg = 176 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Glass Transition Temp, Tg 80.0 °C
176 °F
ISO 11357-1
Murtfeldt Murylon® HT Nylon 46
The use of this highly temperature resistant polyamide enables reliable operation up to a constant service temperature of 155°C . The material retains its rigidity and creep strength over the entir..
Glass Transition Temp, Tg 80.0 °C
176 °F
DSC
Eastman EASTALLOY Polymer DA003-8999K, Clear Alloy  (discontinued **)
Properties below based on a film thickness of 250 microns. CO2 Permeability is 49 cm3·mm/m2·24h·atm per ASTM D 1434.Product Description: EASTALLOY DA003-8999K Polymer is a clear copolyester/pol..
Glass Transition Temp, Tg 80.0 °C
176 °F
10°C/min; DAM; ISO 11357-1/-2
DuPont Performance Polymers Zytel® 70G30L NC010 Nylon 66  (Unverified Data**)
Zytel® 70G30L NC010 is a 30% glass fiber reinforced polyamide 66 resin for injection molding.Information provided by DuPont Performance Polymers
Glass Transition Temp, Tg 80.0 °C
176 °F
ASTM E1640-99 (by DMA)
Lord Adhesives 320 / 322 Epoxy Adhesive
LORD® 320/322 adhesive is a general purpose, two component epoxy adhesive system formulated for primerless adhesion to automotive sheet molded compounds (SMC). This adhesive system also provides ..
Glass Transition Temp, Tg 80.0 °C
176 °F
MCI Method
Mitsui APELâ„¢ APL6509T Cyclo Olefin Copolymer (COC)
This material possesses many characteristics inherent in polyolefins such as excellent electrical insulating properties and outstanding moisture resistance. In addition, it features good melt proces..
Glass Transition Temp, Tg 80.0 °C
176 °F
DSC
SK Chemicals SKYGREEN® PETG 2008 Specially Formulated PET Copolymer Resin
SKYGREEN PETG is an amorphous copolyester in which a certain amount of ethylene glycol is replaced with 1,4-cyclohexane dimethanol (CHDM), which prevent crystallization, leading to improved processa..
Glass Transition Temp, Tg 80.0 °C
176 °F
DSC
Wanshijie PETG Sheet
PETG is also named GPET. It is made of a kind of non-crystalline PET resin sourced from cyclohexanediol modification. PETG differs greatly from PET and PCT. PETG is a kind of non-crystalline copolym..
Glass Transition Temp, Tg 80.0 °C
176 °F
Zeus FEP Tubing
FEP, fluorinated ethylene propylene, is a melt processable fluoropolymer that allows for long, continuous lengths and has several distinct advantages over PTFE. Applications where FEP tubing is usua..
Glass Transition Temp, Tg 80.0 °C
176 °F
DSC
Eastman Drystar 0601 Copolyester, Injection Molded
This product-line is designed to meet the needs of converters seeking value-added solutions to their drying requirements of copolyesters. Eastman’s copolyesters are highly valued for their excellen..
Glass Transition Temp, Tg 80.0 °C
176 °F
Eastman Eastar GN007 PETG Copolyester
ISO data as provided by the manufacturer, Eastman Chemical
Glass Transition Temp, Tg 80.0 °C
176 °F
DSC
Eastman GSP01 Copolyester for Film and Sheet Extrusion
Applications:Consumer e-packaging trayElectronic packagingElectrostatic dissipative trayProduct Description: GSP01 is a clear, amorphous material. Because of its clarity, toughness and good melt s..
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® 301-2 Optically Transparent Epoxy
Product Description: EPO-TEK® 301-2 is a two component optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.Advantages & Appli..
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® EK1000-MP Epoxy
Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding ..
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos..
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy
Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte..
Glass Transition Temp, Tg 80.0 °C
176 °F
Epoxy Technology EPO-TEK® M10-D Epoxy Paste
Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® OM125 Optical Epoxy
Product Description: EPO-TEK® OM125 is two component, high Tg, optical epoxy designed for bonding multi-mode fiber optic connectors. Advantages & Application Notes: Color coded blue for easy operat..
Glass Transition Temp, Tg 80.0 °C
176 °F
DAM; 10°C/min; ISO 11357-1/-2
DuPont Performance Polymers Zytel® 70G30L NC010 Nylon 66  (Unverified Data**)
30% Glass Reinforced Polyamide 66Zytel 70G30L NC010 is a 30% glass fiber reinforced polyamide 66 resin for injection molding.Information provided by DuPont Performance Polymers
Glass Transition Temp, Tg 80.0 °C
176 °F
DAM; 10°C/min; ISO 11357-1/-2
DuPont Performance Polymers Zytel® 70G43HSLA BK099 Nylon 66  (Unverified Data**)
43% Glass Reinforced Heat Stabilized Polyamide 66 Zytel 70G43HSLA BK099 is a 43% glass fiber reinforced heat stabilized black polyamide 66 resin for injection molding.Information provided by DuPont ..
Glass Transition Temp, Tg 80.0 °C
176 °F
Epoxyset Epoxibond EB-301 Low Expansion Epoxy Adhesive
EB-301 is a highly filled, low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional stability ..
Glass Transition Temp, Tg 80.0 °C
176 °F
DAM; 10°C/min; DS; ISO 11357-1/-2
DuPont Performance Polymers Zytel® FR50 NC010A Nylon 66  (Unverified Data**)
25% Glass Reinforced Flame Retardant Polyamide 66 Zytel FR50 NC010A is a 25% glass fiber reinforced flame retardant polyamide 66 resin for injection molding.Information provided by DuPont Performanc..
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—250°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min
Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J..
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a ..
Glass Transition Temp, Tg 80.0 °C
176 °F
10°C/min; DAM; ISO 11357-1/-2
DuPont Performance Polymers Zytel® 70G35HSLX BK357 Nylon 66  (Unverified Data**)
Zytel® 70G35HSLX BK357 is a 35% glass fiber reinforced, heat stabilized, black polyamide 66 for injection molding.Information provided by DuPont Performance Polymers
Glass Transition Temp, Tg 80.0 °C
176 °F
10°C/min; DAM; ISO 11357-1/-2
DuPont Performance Polymers Zytel® 70G43HSLA BK099 Nylon 66  (Unverified Data**)
Zytel® 70G43HSLA BK099 is a 43% glass fiber reinforced, heat stabilized, black polyamide 66 resin for injection molding.Information provided by DuPont Performance Polymers
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