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Polymer Property : Melting Point = 361 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Melting Point | 183 °C | 361 °F | |
| Omnia Plastica PA 11 Rilsan B The only engineering plastic of natural origin (derived from castor oil), it is a polyamide which, unlike the other nylons, does not absorb humidity. It has all the good mechanical features of polya.. |
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| Melting Point | 183 °C | 361 °F | DSC, both heating and cooling speeds of 10°C/min |
| Noltex Soarnol® DC3203F Ethylene Vinyl Alcohol Copolymer Low ethylene content. Suitable for use in packaging material used at normal temperature and humidity. Ethylene content 32 mol%. Volatile matter 0.3%.Information provided by Soarus, LLC. In the Un.. |
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| Melting Point | 183 °C | 361 °F | Fisher-Johns test |
| DuPont Selar® RB 421 EVOH Barrier Resin
(discontinued **) Selar® RB 421 barrier resin is a pellet blend of EVOH (ethylene vinyl alcohol) and a proprietary adhesive for EVOH and polyethylene.Selar® RB 421 has been designed for use in blends with polyethyl.. |
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| Melting Point | 183 °C | 361 °F | DSC |
| EVALCA EVAL® EP-J102B Ethylene Vinyl Alcohol Copolymer Resin
(discontinued **) 32 mol % Ethylene.Data provided by EVALCA. Designed to provide a wide thermoforming range together with high barrier properties. EVAL® EP-J102B is specifically designed for thermoforming applicat.. |
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| Melting Point | 183 - 200 °C | 361 - 392 °F | |
| Indium Corp. Indalloy 113 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 - 257 °C | 361 - 495 °F | |
| Indium Corp. Indalloy 141 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 - 280 °C | 361 - 536 °F | |
| Indium Corp. Indalloy 149 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 °C | 361 °F | |
| Lucas-Milhaupt 63 Sn-37 Pb Tin/ Silver Solder Characteristics:Although widely used in electronics for both manual and automatic soldering applications, it is also used in general purpose applications where fast alloy flow is desired. This allo.. |
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| Melting Point | 183 - 191 °C | 361 - 376 °F | |
| Indium Corp. Indalloy 109 Tin-Lead Solder Alloy Good electrical grade solderInformation Provided by Indium Corporation |
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| Melting Point | 183 - 199 °C | 361 - 390 °F | |
| Indium Corp. Indalloy 112 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 - 216 °C | 361 - 421 °F | |
| Indium Corp. Indalloy 119 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 - 218 °C | 361 - 424 °F | |
| Indium Corp. Indalloy 120 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 - 222 °C | 361 - 432 °F | |
| Indium Corp. Indalloy 122 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 - 187 °C | 361 - 369 °F | |
| Suqian Unitechem Antioxidant 168 Chemical Name: Tris-(2,4-di-tert-butyl-phenyl)-phosphiteCAS NO.: 31570-04-4Molecular Formula: C42H63O3PProperties: The product takes on an appearance of white powder, without odor and smell. Solubl.. |
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| Melting Point | 183 - 188 °C | 361 - 370 °F | |
| Williams Advanced Alloys WS188 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| Melting Point | 183 - 205 °C | 361 - 401 °F | |
| Williams Advanced Alloys WS205 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| Melting Point | 183 - 212 °C | 361 - 414 °F | |
| Williams Advanced Alloys WS212 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| Melting Point | 183 °C | 361 °F | |
| Goodfellow Tin 60/Lead 39/Antimony 1 Alloy A general purpose, low melting point soft solder which can also be used as a protective coating and for metal film capacitors.Information provided by Goodfellow. |
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| Melting Point | <= 183 °C | <= 361 °F | Peak Melting Point; ExxonMobil method |
| ExxonMobil Escorene™ UL 00119 Ethylene Vinyl Acetate Copolymer (European Grade) Product Description: UL 00119 is a fractional MI copolymer of ethylene and vinyl acetate.Availability: Africa & Middle East and Europe Additive: Antiblock: NoSlip: No Thermal Stabilizer: Yes Applic.. |
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| Melting Point | <= 183 °C | <= 361 °F | Peak Melting Point; ExxonMobil method |
| ExxonMobil Escorene™ FL 00119 Ethylene Vinyl Acetate Copolymer (European Grade) Product Description: FL 00119 is a copolymer of ethylene and vinyl acetate offering low gel. Availability: Africa & Middle East and Europe Additive: Antiblock: NoSlip: NoThermal Stabilizer: Yes Ap.. |
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| Melting Point | 183 °C | 361 °F | (Dry) |
| Arkema Group Rilsan® BECN W3 TL Nylon 11, Sheathing Grade (Conditioned) Designation ISO 1874-PA11,KFHL,12-010Rigid grade for sheathing wires and cables. Available color: natural. Light and heat stabilized. Flame retardant agent.Fire-resistant. High abrasion resistance. .. |
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| Melting Point | 183 °C | 361 °F | (Dry) |
| Arkema Group Rilsan® BMN D Nylon 11 (Conditioned) Designation ISO 1874-PA11,MR,12-010Rigid grade for injection molding. Available colors: black, blue, natural, orange, white. Mold release agent.High mechanical properties. Easy filling of the mold d.. |
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| Melting Point | 183 °C | 361 °F | 10°C/min |
| Arkema Group Rilsan® BMV Nylon 11 (Dry) Designation ISO 1874-PA11,M,18-010Rigid grade for injection molding. Available color: natural. Free additive.High impact strength. Easy filling of the mold due to its well adapted melt viscosity. Lo.. |
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| Melting Point | 183 °C | 361 °F | 10°C/min |
| Arkema Group Rilsan® BZM 30 TL Nylon 11, 30% Glass Fiber Filled (Dry) Designation ISO 1874-PA11,MHL,18-050,GF30Rigid grade with glass fiber (30%) filler for injection molding. Available colors: black and natural. Light and heat stabilized.Rigidity. High compressive st.. |
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| Melting Point | 183 °C | 361 °F | (Dry) |
| Arkema Group Rilsan® BZM 43 G9 Nylon 11, 43% Glass Fiber Filled (Conditioned) Designation ISO 1874-PA11,MS,18-080,(G+C)(F+D)(45+05)Rigid grade with glass fiber (43%) and graphite filler for injection molding. Available color: steel black gray. Additive free.High rigidity. Hig.. |
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| Melting Point | 183 °C | 361 °F | 10°C/min |
| Arkema Group Rilsan® MB 3750 Nylon 11, Transparent Grade (Dry) Designation ISO 1874-PA11/xx,F,THL,22-020Transparent semi-crystalline PA11 grade.Used for film extrusion and injection molding (low thickness).Very good low temperature impact strength.High chemical.. |
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| Melting Point | 183 °C | 361 °F | (Dry) |
| Arkema Group Rilsan® BESN G9 TL Nylon 11, Graphite Filled (Conditioned) Designation ISO 1874-PA11,EHLS,18-010,CD10Grade with graphite filler for tubes extrusion. Available color: steel gray. Light and heat stabilized.No need of lubricant. Low friction coefficient. Good .. |
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| Melting Point | 183 °C | 361 °F | 10°C/min |
| Arkema Group Rilsan® BESN P20 TL Nylon 11, Flexible Tubing Grade (Dry) Designation ISO 1874-PA11-P,EHL,22-004Flexible grade for tubes extrusion. Available color: black and natural. Light and heat stabilized.Flexibility. High impact strength. Very good chemical resistan.. |
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| Melting Point | 183 °C | 361 °F | |
| AIM 63Sn/Pb37 Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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| Melting Point | 183 - 184 °C | 361 - 363 °F | |
| Indium Corp. Indalloy 107 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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