Polymer Property : Tensile Strength at Break = 51.7 MPa Product List

Mechanical Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Mechanical Properties	Metric	English	Comments
Tensile Strength at Break	51.7 MPa	7500 psi	ASTM D638
Oxford Polymers Oxnilon 66-15-IMP Impact Modified Nylon 66 for Injection Molding Impact Modified Nylon 66 for Injection MoldingInformation provided by Oxford Polymers.
Tensile Strength at Break	51.7 MPa	7500 psi	ASTM D638
Polymer Resources AC-GP2-TFE5 Acetal Copolymer, 5% PTFE Process: Molding or ExtrusionNotes: All physical, mechanical and thermal testing conducted on 1/8-inch thick, un-pigmented, test samples.Information provided by Polymer Resources Corporation.
Tensile Strength at Break	51.7 MPa	7500 psi	ASTM D638
Polymer Resources PC/ASA-GP2 Polycarbonate/ASA Alloy Acrylonitrile Styrene Acrylate + PolycarbonatePreliminary DataProcess: Injection MoldingNotes: All physical, mechanical and thermal testing conducted on 1/8-inch thick, un-pigmented, test samples.In..
Tensile Strength at Break	51.7 MPa	7500 psi	ASTM D638
Ravago Manufacturing Americas Hylon® N1000STHL Nylon 6/6 (DAM) Information provided by Ravago
Tensile Strength at Break	51.7 MPa	7500 psi	ASTM D638
Polymer Resources PC/TP-GP2 PC Polyester, High Impact, Excellent Chemical Resistance (Unverified Data**)& Process: Injection MoldingNotes: All physical, mechanical and thermal testing conducted on 1/8-inch thick, un-pigmented, test samples. Information provided by Polymer Resources Corporation.
Tensile Strength at Break	51.7 MPa	7500 psi	ASTM D638
Techmer ES PlaslubeÂ® PC-50/TF/15 NAT Polycarbonate
Tensile Strength at Break	51.7 MPa	7500 psi	ASTM D638
Techmer ES PlaslubeÂ® PC-50/TF/22 BK223 Polycarbonate
Tensile Strength at Break	>= 51.7 MPa @Temperature 23.9 °C	>= 7500 psi @Temperature 75.0 °F
Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user frien..
Tensile Strength at Break	51.7 MPa @Temperature 23.9 °C	7500 psi @Temperature 75.0 °F
Master Bond EP21TDCF-3 Two Component, Higher Viscosity Epoxy System Product Description: Master Bond EP21TDCF-3 is a two component epoxy for high performance bonding and sealing. It is formulated to cure rapidly at room temperature or faster at elevated temperatures..
Tensile Strength at Break	>= 51.7 MPa	>= 7500 psi	30 minute cure at 250°F
Master Bond Supreme 3HT-80 High Strength Epoxy Adhesive Cures at 80°C Description: Master Bond Supreme 3HT-80 is a one component, heat curing epoxy system featuring excellent physical strength properties and toughness with an eye-catching curing temperature of 170-175..
Tensile Strength at Break	>= 51.7 MPa @Temperature 23.9 °C	>= 7500 psi @Temperature 75.0 °F
Master Bond EP21CLV Two Component Epoxy System Product Description: Master Bond EP21CLV is a two component, lower viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It features easy handling a..
Tensile Strength at Break	>= 51.7 MPa	>= 7500 psi
Master Bond Supreme 33 High Temperature Resistant, Structural Adhesive Description: Master Bond Polymer System Supreme 33 is a unique, room temperature curing, toughened epoxy adhesive/sealant, offering high temperature resistance. This innovative system offers high bo..
Tensile Strength at Break	51.7 MPa	7500 psi	ASTM D638
Americas Styrenics STYRON® 685DL High Heat Crystal Polystyrene Product CharacteristicsHigh heat resistanceHigh tensile strengthBlue tintFood Contact CompliantTypical ApplicationsFoamOPSMedicalInformation provided by AmericasStyrenics LLC.
Tensile Strength at Break	51.7 MPa	7500 psi	ASTM D638
Techmer ES Plastiblend® ABS/PA 1700 Availability: North AmericaForms: PelletsAppearance: Natural ColorInformation provided by TP Composites, Inc.
Tensile Strength at Break	51.7 MPa	7500 psi	TM R050-36
Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP691 is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and ad..