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Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant

Category Polymer , Thermoset , Epoxy , Epoxy Cure Resin , Epoxy Encapsulant, Unreinforced
Manufacturer Resinlab®
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant.pdf
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Material Notes:
Resinlab™ EP691 is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release and a smooth high gloss surface. It has very good resistance to water, acids and bases and most organic solvents. It was especially formulated to a 2A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP691 will reach full cure at room temperature within 24 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 20 minutes at 100°C are typical for small castings (less than 50 grams).Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Physical Properties Metric English Comments
Specific Gravity 1.00 g/cc
1.00 g/cc
Part B; TM R050-16
1.11 g/cc
1.11 g/cc
Mixed; TM R050-16
1.16 g/cc
1.16 g/cc
Part A; TM R050-16
Water Absorption 0.17 %

@Time 86400 sec
0.17 %

@Time 24.0 hour
TM R050-35
Viscosity 2500 cP
2500 cP
Part B, RVT, #2, 20 rpm; TM R050-12
9000 cP
9000 cP
Mixed; TM R050-12
16000 cP
16000 cP
Part A, RVT, #6, 20 rpm; TM R050-12
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
TM R050-17
Tensile Strength at Break 51.7 MPa
7500 psi
TM R050-36
Tensile Strength, Ultimate 58.6 MPa
8500 psi
TM R050-36
Tensile Strength, Yield 48.3 MPa
7000 psi
TM R050-36
Elongation at Break 4.0 - 9.0 %
4.0 - 9.0 %
TM R050-36
Tensile Modulus 2.76 GPa
400 ksi
TM R050-36
Compressive Yield Strength 79.3 MPa
11500 psi
TM R050-38
Compressive Strength 172 MPa
25000 psi
Break; TM R050-38
172 MPa
25000 psi
Ultimate; TM R050-38
Compressive Modulus 2.90 GPa
420 ksi
TM R050-38
Adhesive Bond Strength 13.8 MPa
2000 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Thermal Properties Metric English Comments
CTE, linear 54.0 µm/m-°C
30.0 µin/in-°F
Thermal Conductivity 0.140 W/m-K
0.972 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Glass Transition Temp, Tg 80.0 °C
176 °F
TM R050-25
Electrical Properties Metric English Comments
Volume Resistivity 8.00e+14 ohm-cm
8.00e+14 ohm-cm
Dielectric Constant 4.2

@Frequency 100 Hz,
Temperature 25.0 °C
4.2

@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 16.1 kV/mm
410 kV/in
Processing Properties Metric English Comments
Pot Life >= 120 min
>= 120 min
Mass: 50g; TM R050-19
Descriptive Properties Value Comments
Color Light Amber
Mix Ratio 100:45
Weight
2:1
Volume
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