Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant

Category	Polymer , Thermoset , Epoxy , Epoxy Cure Resin , Epoxy Encapsulant, Unreinforced
Manufacturer	Resinlab®
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Resinlab™ EP691 is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release and a smooth high gloss surface. It has very good resistance to water, acids and bases and most organic solvents. It was especially formulated to a 2A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP691 will reach full cure at room temperature within 24 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 20 minutes at 100°C are typical for small castings (less than 50 grams).Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

Physical Properties	Metric	English	Comments
Specific Gravity	1.00 g/cc	1.00 g/cc	Part B; TM R050-16
	1.11 g/cc	1.11 g/cc	Mixed; TM R050-16
	1.16 g/cc	1.16 g/cc	Part A; TM R050-16
Water Absorption	0.17 % @Time 86400 sec	0.17 % @Time 24.0 hour	TM R050-35
Viscosity	2500 cP	2500 cP	Part B, RVT, #2, 20 rpm; TM R050-12
	9000 cP	9000 cP	Mixed; TM R050-12
	16000 cP	16000 cP	Part A, RVT, #6, 20 rpm; TM R050-12

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80	TM R050-17
Tensile Strength at Break	51.7 MPa	7500 psi	TM R050-36
Tensile Strength, Ultimate	58.6 MPa	8500 psi	TM R050-36
Tensile Strength, Yield	48.3 MPa	7000 psi	TM R050-36
Elongation at Break	4.0 - 9.0 %	4.0 - 9.0 %	TM R050-36
Tensile Modulus	2.76 GPa	400 ksi	TM R050-36
Compressive Yield Strength	79.3 MPa	11500 psi	TM R050-38
Compressive Strength	172 MPa	25000 psi	Break; TM R050-38
	172 MPa	25000 psi	Ultimate; TM R050-38
Compressive Modulus	2.90 GPa	420 ksi	TM R050-38
Adhesive Bond Strength	13.8 MPa	2000 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37

Thermal Properties	Metric	English	Comments
CTE, linear	54.0 µm/m-°C	30.0 µin/in-°F
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	121 °C	250 °F
Minimum Service Temperature, Air	-40.0 °C	-40.0 °F
Glass Transition Temp, Tg	80.0 °C	176 °F	TM R050-25

Electrical Properties	Metric	English
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Dielectric Constant	4.2 @Frequency 100 Hz, Temperature 25.0 °C	4.2 @Frequency 100 Hz, Temperature 77.0 °F
Dielectric Strength	16.1 kV/mm	410 kV/in

Processing Properties	Metric	English	Comments
Pot Life	>= 120 min	>= 120 min	Mass: 50g; TM R050-19

Descriptive Properties	Value	Comments
Color	Light Amber
Mix Ratio	100:45	Weight
	2:1	Volume

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