Polymer Property : Viscosity = 200000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	200000 cP @Temperature 400 °C	200000 cP @Temperature 752 °F	melt; ISO 11443
Victrex® PEEK 90GL30 Polyetheretherketone, 30% Glass Fiber Reinforced Product Description:High performance thermoplastic material, 30% glass fibre reinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding, very easy flow, FDA food conta..
Viscosity	200000 cP @Temperature 400 °C	200000 cP @Temperature 752 °F	melt; ISO 11443
Victrex® PEEK -HT™ G22 PolyEtherKetone, Unreinforced Product Description:High performance thermoplastic material, unreinforced PolyEtherKetone (PEK), semi crystalline, depth filtered granules for injection moulding, easy flow, FDA food contact complia..
Viscosity	200000 cP	200000 cP	Part A, Spindle TD, 2.5 rpm; Uncured
Resinlab® AR 4400 HP Metal & Composite Bonding Methacrylate Adhesive Resinlab™ AR 4400 HP is a 1:1 mix methacrylate-based structural adhesive formulated to bond almost all engineered thermoplastics, thermosets, composites, and metal structural elements together in a..
Viscosity	200000 cP	200000 cP	Part B, Spindle TD, 2.5 rpm; Uncured
Resinlab® AR 4400 HP Metal & Composite Bonding Methacrylate Adhesive Resinlab™ AR 4400 HP is a 1:1 mix methacrylate-based structural adhesive formulated to bond almost all engineered thermoplastics, thermosets, composites, and metal structural elements together in a..
Viscosity	200000 cP	200000 cP	Spindle TD, 2.5 rpm; Curing
Resinlab® AR 4400 HP Metal & Composite Bonding Methacrylate Adhesive Resinlab™ AR 4400 HP is a 1:1 mix methacrylate-based structural adhesive formulated to bond almost all engineered thermoplastics, thermosets, composites, and metal structural elements together in a..
Viscosity	200000 - 260000 cP	200000 - 260000 cP
Lord Adhesives Metech 3501 Palladium Silver Conductor Composition Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide proc..
Viscosity	200000 - 260000 cP	200000 - 260000 cP
Lord Adhesives Metech 3502 Palladium Silver Conductor Composition Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide proc..
Viscosity	200000 - 260000 cP	200000 - 260000 cP
Lord Adhesives Metech 3503 Palladium Silver Conductor Composition Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide proc..
Viscosity	200000 - 260000 cP	200000 - 260000 cP
Lord Adhesives Metech 3504 Palladium Silver Conductor Composition Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide proc..
Viscosity	200000 - 260000 cP	200000 - 260000 cP
Lord Adhesives Metech 3505 Palladium Silver Conductor Composition Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide proc..
Viscosity	200000 cP	200000 cP	Melt Viscosity, 260Â°C, 1500 sec-1; ISO 11443
SABIC Innovative Plastics ValoxÂ® 553 PBT (Europe-Africa-Middle East) VALOX 553 is a 30% glass fibre reinforced, flame retardant PBT+PC blend with good warpage characteristics. Applications: appliance handles, spotlights, electric motors, pumphousings.
Viscosity	200000 - 600000 cP	200000 - 600000 cP	Part A
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation ..
Viscosity	>= 200000 cP	>= 200000 cP
Master Bond EP65ND Fast Curing, High Shear Strength Epoxy This two component adhesive system is formulated to cure quickly at ambient temperatures e.g. 8-10 minutes, shorter lives at higher temperatures for maximum bond strength. Tensile lap shear strength..
Viscosity	>= 200000 cP	>= 200000 cP	Part B
Master Bond MasterSil 153Med Silicone Paste for Medical Applications Description: Master Bond MasterSil 153Med is a two component silicone compound with a paste consistency for high performance bonding and sealing. It can be used for medical device applications as it..
Viscosity	200000 cP @Shear Rate 100 1/s, Temperature 300 °C	200000 cP @Shear Rate 100 1/s, Temperature 572 °F
DuPont Selar® PA 3426 Nylon Barrier Resin Selar® PA 3426 is an amorphous nylon (polyamide) resin which exhibits superior transparency, good barrier properties to gases, water, solvents and essential oils and high temperature structural pro..
Viscosity	200000 cP	200000 cP	at 20 RPM
Loctite® 332 Severe Environment Structural Adhesive Acrylic Bonding AdhesivesLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impact, stress and shock resistance. ..
Viscosity	>= 200000 cP @Temperature 23.0 °C	>= 200000 cP @Temperature 73.4 °F
Master Bond EP3HTMED One Component, Biocompatible Epoxy System Master Bond Polymer System EP3HTMed combines the ease of a one part, no mix, fast curing adhesive with high shear strength. This special formulation fully meets USP Class VI requirements. EP3HTMed p..
Viscosity	200000 - 300000 cP	200000 - 300000 cP	Part A
Master Bond Supreme 11AOHTLO Epoxy Passes NASA Low Outgassing Tests Description: Master Bond Supreme 11AOHTLO is a two component epoxy resin system for high performance bonding and sealing. Although, it is formulated to cure at room temperature, the best cure schedu..
Viscosity	200000 cP	200000 cP	dynamic
Dow Corning 7-3099 DIMETHICONE HIP EMULSION A concentrated emulsion of Dimethicone (100 cSt) that is designed to facilitate the rapid development of skin care formulations which contain this emollient. Typical applications include: suncare, b..
Viscosity	200000 cP @Shear Rate 1000 1/s, Temperature 280 °C	200000 cP @Shear Rate 1000 1/s, Temperature 536 °F
DSM Akulon® F127 PA6 Low/Medium Viscosity, Film Extrusion
Viscosity	200000 cP @Shear Rate 1000 1/s, Temperature 260 °C	200000 cP @Shear Rate 1000 1/s, Temperature 500 °F	melt viscosity; b.o. ISO 11443-A
Covestro Bayblend® FR630 GR PC/ABS Blend Main characteristics:• High toughness even at low temperatures• High dimensional accuracy and stability• Good paintability• Good flowabilityGrade characteristics:• Flame-retardant• Injec..
Viscosity	200000 cP @Shear Rate 1000 1/s, Temperature 260 °C	200000 cP @Shear Rate 1000 1/s, Temperature 500 °F
DSM Akulon® F128 PA6 Film Extrusion, Medium Viscosity
Viscosity	200000 cP @Shear Rate 1000 1/s, Temperature 280 °C	200000 cP @Shear Rate 1000 1/s, Temperature 536 °F
DSM Akulon® XP32-C1 PA6 Film Extrusion, Medium Viscosity, Lubricated
Viscosity	200000 cP @Shear Rate 1000 1/s, Temperature 280 °C	200000 cP @Shear Rate 1000 1/s, Temperature 536 °F
DSM Akulon® XP36-E1 PA6 Film Extrusion, Medium Viscosity, Nucleated, Lubricated
Viscosity	200000 cP	200000 cP	uncured
Atom Adhesives AA-DUCT 904 Epoxy Adhesive AA-DUCT 904 is a single component, heat curing, conductive epoxy that was designed for ease in handling. This high performance conductive epoxy cures quickly at elevated temperatures making it ideal..
Viscosity	200000 cP	200000 cP	B Component; Spindle #7; speed 10 rpm; ASTM D1824
Aptek 6550-A/B Epoxy Encapsulant High thermal conductivity, microelectronic grade blob-top encapsulant. Ultra high purity. Excellent heat and moisture protection for sensitive chips/circuitry. Premixed frozen syringes available for..
Viscosity	200000 - 5.00e+6 cP @Temperature 240 - 280 °C	200000 - 5.00e+6 cP @Temperature 464 - 536 °F	Average value: 1.26e+6 cP Grade Count:6
Overview of materials for Nylon 6, Film Grade This property data is a summary of similar materials in the MatWeb database for the category "Nylon 6, Film Grade". Each property range of values reported is minimum and maximum values of appropriat..
Viscosity	200000 - 700000 cP @Temperature 400 - 420 °C	200000 - 700000 cP @Temperature 752 - 788 °F	Average value: 445000 cP Grade Count:13
Overview of materials for Polyetheretherketone, Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyetheretherketone, Glass Fiber Filled". Each property range of values reported is minimum and maximum..