Polymer Property : Viscosity = 50000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	50000 cP	50000 cP	Part A, RVT, #7, 2.5 rpm; TM R050-12
Resinlab® EP1290 Clear Mineral Filled Epoxy Adhesive Resinlab™ EP1290 Clear is a two part mineral filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-flexible material. It has good wetting to ..
Viscosity	50000 - 75000 cP	50000 - 75000 cP
Huntsman HY 815 US Polyamide Approx. H+ equivalent weight 150. Mix Ratio with GY 6010 is 81.Comments/Applications: Solvent free, high molecular weight, low amine content. Superior adhesion, easily pigmented. Trade sale pain..
Viscosity	50000 - 70000 cP	50000 - 70000 cP	B
ITW Plexus Plexusâ„¢ AO420 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose adhesive , high toughness.Information provided by Illinois Tool Works.
Viscosity	50000 - 70000 cP	50000 - 70000 cP	B
ITW Plexus Plexusâ„¢ MA1021 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low shrinkage.Information provided by Illinois Tool Works.
Viscosity	50000 - 70000 cP	50000 - 70000 cP	B
ITW Plexus Plexusâ„¢ MA1023 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, all purpose.Information provided by Illinois Tool Works.
Viscosity	50000 - 80000 cP	50000 - 80000 cP	B
ITW Plexus Plexusâ„¢ MA822 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Designed for structural bonding of metals without primers.Information provided by Illinois Tool Wo..
Viscosity	50000 cP @Temperature 23.0 Â°C	50000 cP @Temperature 73.4 Â°F
Momentive Performance Materials TSE397 One Component RTV Adhesive Sealant/Coating, Clear/White TSE392, TSE397 and TSE399 adhesive sealants/coatings are one component RTVâ€™s that cure quickly by reacting with atmospheric moisture forming a soft dielectric silicone rubber. These materials i..
Viscosity	50000 cP	50000 cP
Shin-Etsu Silicones KE-3494 Silicone, RTV Information Provided by Shin-Etsu Silicones of America, Inc.
Viscosity	50000 - 65000 cP	50000 - 65000 cP	Part B
Master Bond EP21AOLV-1 Two Part, Room Temperature Curing Epoxy System Product Description: Master Bond Polymer Adhesive EP21AOLV-1 is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant and coating. This versatile system will adhere t..
Viscosity	50000 cP	50000 cP	available as EP21TP
Master Bond EP21TPND Two Component Polysulfide Epoxy Adhesive Master Bond Polymer Adhesive EP21TPND is a two component polysulfide epoxy based adhesive / sealant formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Pol..
Viscosity	50000 - 60000 cP @Temperature 23.0 °C	50000 - 60000 cP @Temperature 73.4 °F
Master Bond EP24 Fast Curing Two Component Epoxy System Master Bond Polymer Adhesive EP24 is a fast curing two component epoxy adhesive for general purpose bonding, sealing, and coating formulated to cure at room temperature with a one-to-one mix ratio, ..
Viscosity	50000 - 60000 cP	50000 - 60000 cP
Master Bond EP45HTMED Epoxy Resists Radiation and Steam Sterilization Description: Master Bond Polymer System EP45HTMED is a two component heat cured epoxy system for high performance structural bonding, sealing, coating and casting. It is especially designed for the ..
Viscosity	50000 - 90000 cP	50000 - 90000 cP	Part B
Master Bond EP51FL Toughened and Flexible Adhesive Compound Master Bond EP51FL is a two component epoxy system for high performance bonding sealing and coating. It combines superior toughness with user friendly handling properties, along with unusually fast ..
Viscosity	50000 cP @Temperature 25.0 °C	50000 cP @Temperature 77.0 °F	After mixing
Tra-Con Tra-Bond F156 Optically Opaque Epoxy Adhesive TRA-BOND F156 is a black, solvent-free thixotropic epoxy system recommended for high quality photographic industry bonding, laminating, production and repair applications where a room-temperature cu..
Viscosity	50000 cP	50000 cP	Haake cone and plate rheometer @ 5/sec (35mm/2° cone)
Loctite® 3533 Low viscosity fill encapsulant Fill Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp..
Viscosity	50000 - 120000 cP	50000 - 120000 cP	Part A
Master Bond EP42HT-2AO-1 Two Part, Cryogenically Serviceable Epoxy Description: Master Bond EP42HT-2AO-1 Black is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material that meets NASA low outgassing specifications. It featu..
Viscosity	50000 - 70000 cP	50000 - 70000 cP	uncured coating
Master Bond UV15DC80 One Component, UV and Heat Curable Epoxy System Master Bond UV15DC80 is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curin..
Viscosity	50000 cP	50000 cP
Cotronics Duralco™ 4703 Adhesive and Tooling Compound High temperature resin reinforced with ceramic and metallic fibers and particles, resulting in high thermal stability. Easily machined to close tolerances and will repair and rebuild worn or cracke..
Viscosity	>= 50000 cP	>= 50000 cP
Epoxyset Epoxiohm EO-30FST Electrically Conductive Epoxy Adhesive EO-30-FST is two part, fast cure, silver filled, and high electrical conductivity epoxy adhesive. Both components are silver filled permitting a simple 1:1 mix ratio by weight. It has smooth creamy ..
Viscosity	50000 cP	50000 cP
ACC MM940 Condensation Cure 2-Part Molding Rubber Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: high tear strength, picks up extremely fine details, low viscosity, good resistance to styrene attack, easy degassing..
Viscosity	50000 cP	50000 cP	"A" component
ACC QLE 1020 QSI Quantum Silicones 45 Durometer Clear, Addition Cure Elastomer for Coating QLE 1020 is a 100% silicone solids elastomer designed for fabric or cloth coating applications. This two-component system offers a tough coating with excellent adhesion and fast cure.Key Features: ..
Viscosity	50000 cP	50000 cP	catalyzed with QM 270B
ACC QM 270 QSI Quantum Silicones 70 Durometer Addition Cure Moldmaking Material QM 270 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties, good shelf-life stability, excellent physical properties and resin ..
Viscosity	50000 - 90000 cP	50000 - 90000 cP
Aremco Ceramabond™ 503 High Temperature Ceramic Adhesive/Paste, Alumina Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and..
Viscosity	50000 cP	50000 cP	Mixed; TM R050-12
Resinlab® EP1115 Clear Unfilled Epoxy Adhesive Resinlab™ EP1115 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and..