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Master Bond EP21TPND Two Component Polysulfide Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP21TPND Two Component Polysulfide Epoxy Adhesive.pdf
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Material Notes:
Master Bond Polymer Adhesive EP21TPND is a two component polysulfide epoxy based adhesive / sealant formulated to cure at room temperature or more rapidly at elevated temperatures.  Master Bond Polymer Adhesive/Sealant EP21TPND can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough, flexible bonds and seals which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents.
Physical Properties Metric English Comments
Viscosity 5000 cP
5000 cP
available as EP21TPLV
50000 cP
50000 cP
available as EP21TP
Mechanical Properties Metric English Comments
Adhesive Bond Strength 6.89 MPa

@Temperature 23.0 °C
1000 psi

@Temperature 73.4 °F
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Descriptive Properties Value Comments
Color Code "A" Gray; "B" Amber
Mix Ratio By Weight 100/100
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