Master Bond EP21TPND Two Component Polysulfide Epoxy Adhesive

Category	Polymer , Adhesive , Thermoset , Epoxy
Manufacturer	Master Bond Inc.
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Master Bond EP21TPND Two Component Polysulfide Epoxy Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Master Bond Polymer Adhesive EP21TPND is a two component polysulfide epoxy based adhesive / sealant formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive/Sealant EP21TPND can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough, flexible bonds and seals which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents.

Physical Properties	Metric	English	Comments
Viscosity	5000 cP	5000 cP	available as EP21TPLV
	50000 cP	50000 cP	available as EP21TP

Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	6.89 MPa @Temperature 23.0 °C	1000 psi @Temperature 73.4 °F

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	121 °C	250 °F
Minimum Service Temperature, Air	-51.1 °C	-60.0 °F

Descriptive Properties	Value	Comments
Color Code	"A" Gray; "B" Amber
Mix Ratio By Weight	100/100

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