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Polymer Property : Particle Size = 45 µm Product List
Physical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Particle Size | 45 µm | 45 µm | 0.1% max, wet sieve |
| Magyar Aluminum ALO-DN-3S Alumina Ground Alumina |
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| Particle Size | 45 µm | 45 µm | 0.1% max, wet sieve |
| Magyar Aluminum ALO-DN-4S Alumina Ground Alumina |
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| Particle Size | 45 - 85 µm | 45 - 85 µm | d50 |
| Magyar Aluminum ALO-Ex30 Alumina Calcined Alumina. Min 20% alpha-Al2O3. |
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| Particle Size | 45 - 85 µm | 45 - 85 µm | d50 |
| Magyar Aluminum ALO-Ex325 Alumina Calcined Alumina |
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| Particle Size | 45 - 85 µm | 45 - 85 µm | d50 |
| Magyar Aluminum ALO-P90 Alumina Alumina for Polishing |
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| Particle Size | 45 µm | 45 µm | Maximum of 25% less than |
| H.C. Starck Amperit® 110.074 Agglomerated Sintered (Mo-Mo2C) |
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| Particle Size | 45 µm | 45 µm | Maximum of 7% less than |
| H.C. Starck Amperit® 175.1 Nickel (Ni) |
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| Particle Size | 45 µm | 45 µm | Maximum of 13% less than |
| H.C. Starck Amperit® 175.2 Nickel (Ni) |
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| Particle Size | 45 µm | 45 µm | Maximum of 13% less than |
| H.C. Starck Amperit® 251.2 Gas Atomized (NiCr 80-20) |
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| Particle Size | 45 µm | 45 µm | Maximum of 13% less than |
| H.C. Starck Amperit® 415.2 CoNiCrAlY (MCrAlY) |
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| Particle Size | 45 µm | 45 µm | Minimum of 95% less than |
| H.C. Starck Amperit® 570.3 Sintered Titanium Carbide (TiC) |
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| Particle Size | 45 µm | 45 µm | Maximum of 7% greater than, NiCr |
| H.C. Starck Amperit® 585.3 Chromium Carbide-Nickel Chromium 75-25 (Cr3C2-NiCr) Composition is of Cr3C2 only |
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| Particle Size | 45 µm | 45 µm | Maximum of 5% greater than |
| H.C. Starck Amperit® 849.054 Sintered Yttria (Y2O3) |
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| Particle Size | 45 - 55 µm | 45 - 55 µm | |
| Lucite International Colacryl ® TS1785 Acrylic Dental Resin Cold-curing denture repair resin with Methyl Methacrylate based copolymers. Features fast polymerisation, easy mixing, good clarity, short hydroflask cure cycles, and excellent pigment acceptance.I.. |
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| Particle Size | >= 45 µm | >= 45 µm | |
| Solvay Chemicals Rigmah® BV353 Information provided by Solvay |
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| Particle Size | 45 µm | 45 µm | >50% greater than value; ISO 1624 |
| SolVin 173GB Polyvinyl Chloride Emulsion Polymer Made by emulsion polymerization.
APPLICATIONS
Calendering : plasticized films and sheets
Extrusion : rigid or plasticized pipes and profiles
In most cases, SolVin 173GB resin is used in blends with .. |
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| Particle Size | 45 µm | 45 µm | average; ISO 1624 |
| SolVin 266SF Polyvinyl Chloride Pastes - filler Polymers Made by suspension polymerisation.
APPLICATIONS
Filler polymer for plastisols
- Floor covering : hard-wearing top coats, chemically blown and mechanical foams, impregnation layers
- Wall coverings
-.. |
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| Particle Size | 45 µm | 45 µm | 2 ppm sieve residue; ASTM D1514 |
| TIMCAL ENSACO™ 250G Conductive Carbon Black ENSACO™ & SUPER P™ conductive carbon blacks are carbon blacks with a high to very high void volume allowing the retention of a carbon network at low to very low filler content. The void volume can.. |
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| Particle Size | 45 µm | 45 µm | at a density of 1.85 g/cc, pressure 2.5 t/cc |
| TIMCAL TIMREX® KS15 Primary Synthetic Graphite TIMREX Primary Synthetic Graphite is produced in a unique highly controlled graphitization process which assures narrow specifications and unequalled consistent quality due to: monitoring of all pro.. |
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| Particle Size | 45 µm | 45 µm | at a density of 1.85 g/cc, pressure at 2.5 t/cc |
| TIMCAL TIMREX® KS5-44 Primary Synthetic Graphite TIMREX Primary Synthetic Graphite is produced in a unique highly controlled graphitization process which assures narrow specifications and unequalled consistent quality due to: monitoring of all pro.. |
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| Particle Size | <= 45 µm | <= 45 µm | |
| Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other.. |
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| Particle Size | <= 45 µm | <= 45 µm | |
| Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology |
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| Particle Size | <= 45 µm | <= 45 µm | |
| Epoxy Technology EPO-TEK® EK1000-MP Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding .. |
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| Particle Size | <= 45 µm | <= 45 µm | |
| Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos.. |
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| Particle Size | <= 45 µm | <= 45 µm | |
| Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte.. |
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| Particle Size | <= 45 µm | <= 45 µm | |
| Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electron.. |
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| Particle Size | <= 45 µm | <= 45 µm | |
| Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also .. |
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| Particle Size | <= 45 µm | <= 45 µm | |
| Epoxy Technology EPO-TEK® H31 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic.. |
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| Particle Size | 45 - 151 µm | 45 - 151 µm | Range (D10 to D90); Laser Diffraction |
| ALM D80-ST Nylon 11 SLS Prototyping Polymer Unfilled, color stabilized nylon 11 material that is also stabilized to prevent premature thermal degradation. Parts produced from PA D80-ST exhibit superior mechanical properties. Relatively inexp.. |
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| Particle Size | 45 µm | 45 µm | VW-10700RSFP; D90 Particle sizes by sieve measurement |
| Solvay Specialty Polymers Virantage® VW-10700 RP, RFP, RSFP Polyethersulfone (PESU)
(Unverified Data**)&l Virantage® VW-series functionalized polyethersulfones (r-PESU) are amorphous, high-temperature sulfone polymers featuring reactive end groups to enhance solubility and improve interfacial propertie.. |
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