Physical Properties | Metric | English | Comments |
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Particle Size | 45 - 85 µm | 45 - 85 µm | d50 |
Magyar Aluminum ALO-Ex32 Alumina Calcined Alumina |
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Particle Size | 45 - 85 µm | 45 - 85 µm | d50 |
Magyar Aluminum ALO-Ex325 Alumina Calcined Alumina |
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Particle Size | 45 µm | 45 µm | 1% max, wet sieve |
Magyar Aluminum ALO-G2-2 Alumina Ground Alumina |
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Particle Size | 45 µm | 45 µm | 1% max, wet sieve |
Magyar Aluminum ALO-G22-10 Alumina Ground Alumina |
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Particle Size | 45 µm | 45 µm | 20% max, wet sieve |
Magyar Aluminum ALOLT 710 Aluminum Hydroxide Viscosity Optimized Type |
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Particle Size | 45 µm | 45 µm | 0.5% max, wet sieve |
Magyar Aluminum ALO-P54-04 Alumina Alumina for Polishing |
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Particle Size | 45 µm | 45 µm | 0.5% max, wet sieve |
Magyar Aluminum Zeolite |
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Particle Size | 45 µm | 45 µm | Maximum of 10% less than |
H.C. Starck Amperit® 105.2 Agglomerated Sintered Molybdenum (Mo) |
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Particle Size | 45 µm | 45 µm | Maximum of 20% less than |
H.C. Starck Amperit® 109.063 Agglomerated Sintered Molybdenum (Mo) |
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Particle Size | 45 µm | 45 µm | Maximum of 25% less than |
H.C. Starck Amperit® 110.074 Agglomerated Sintered (Mo-Mo2C) |
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Particle Size | 45 µm | 45 µm | Maximum of 30%, Mo |
H.C. Starck Amperit® 119.075 Molybdenum-Nickel SF RC 60 75-25 (Mo / NiSF) Composition is of NiSF RC 60 only |
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Particle Size | 45 µm | 45 µm | Maximum of 13% less than |
H.C. Starck Amperit® 175.2 Nickel (Ni) |
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Particle Size | 45 µm | 45 µm | Maximum of 7% greater than |
H.C. Starck Amperit® 410.1 Gas Atomized (NiCoCrAlY) |
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Particle Size | 45 µm | 45 µm | Maximum of 7% greater than |
H.C. Starck Amperit® 413.3 Gas Atomized (NiCoCrAlY) |
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Particle Size | 45 µm | 45 µm | Maximum of 10% less than |
H.C. Starck Amperit® 518.002 Agglomerated, Sintered Tungsten Carbide-Cobalt 88-12 (WC-CO) |
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Particle Size | 45 µm | 45 µm | Maximum of 7% greater than, NiCr |
H.C. Starck Amperit® 585.3 Chromium Carbide-Nickel Chromium 75-25 (Cr3C2-NiCr) Composition is of Cr3C2 only |
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Particle Size | 45 µm | 45 µm | Maximum of 10% less than |
H.C. Starck Amperit® 847.6 Agglomerated Yttria (Y2O3) |
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Particle Size | 45 µm | 45 µm | Maximum of 5% less than |
H.C. Starck Amperit® 140.2 Tungsten (W) HS Number: 81011000 |
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Particle Size | 45 µm | 45 µm | Before Conversion |
Silberline Extra Sparkle Silvet® 300-10-E1 Sparkle Silvet® E1 grades are easy to disperse and are compatible with a variety of polymers, particularly polyolefins. They are typically used to make concentrates or compounds for use in final .. |
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Particle Size | 45 µm | 45 µm | Before Conversion |
Silberline Extra Sparkle Silvex® 300-10-D Sparkle Silvex® D grades are aluminum pigment flakes dampened with a plasticizer to help prevent the individual flakes from becoming airborne during handling and processing. They are well suited .. |
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Particle Size | 45 µm | 45 µm | 2 ppm sieve residue; ASTM D1514-01 |
TIMCAL ENSACO™ 150G Conductive Carbon Black ENSACO™ & SUPER P™ conductive carbon blacks are carbon blacks with a high to very high void volume allowing the retention of a carbon network at low to very low filler content. The void volume can.. |
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Particle Size | 45 µm | 45 µm | 2 ppm sieve residue; ASTM D1514 |
TIMCAL ENSACO™ 210G Conductive Carbon Black ENSACO™ & SUPER P™ conductive carbon blacks are carbon blacks with a high to very high void volume allowing the retention of a carbon network at low to very low filler content. The void volume can.. |
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Particle Size | <= 45 µm | <= 45 µm | |
Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe.. |
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Particle Size | <= 45 µm | <= 45 µm | |
Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology |
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Particle Size | <= 45 µm | <= 45 µm | |
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al.. |
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Particle Size | <= 45 µm | <= 45 µm | |
Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte.. |
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Particle Size | <= 45 µm | <= 45 µm | |
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, .. |
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Particle Size | <= 45 µm | <= 45 µm | |
Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electron.. |
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Particle Size | 45 - 151 µm | 45 - 151 µm | Range (D10 to D90); Laser Diffraction |
ALM FR 106 Nylon 11 SLS Prototyping Polymer This flame retardant rapid prototyping material has additives in the raw material that allows it to pass aeronautic standard FAR25.853 smoke, flame, and toxicity tests. This material is ideal for Ae.. |