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Polymer Property : Particle Size = 45 µm Product List

Physical Properties

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Physical Properties Metric English Comments
Particle Size 45 - 85 µm
45 - 85 µm
d50
Magyar Aluminum ALO-Ex32 Alumina
Calcined Alumina
Particle Size 45 - 85 µm
45 - 85 µm
d50
Magyar Aluminum ALO-Ex325 Alumina
Calcined Alumina
Particle Size 45 µm
45 µm
1% max, wet sieve
Magyar Aluminum ALO-G2-2 Alumina
Ground Alumina
Particle Size 45 µm
45 µm
1% max, wet sieve
Magyar Aluminum ALO-G22-10 Alumina
Ground Alumina
Particle Size 45 µm
45 µm
20% max, wet sieve
Magyar Aluminum ALOLT 710 Aluminum Hydroxide
Viscosity Optimized Type
Particle Size 45 µm
45 µm
0.5% max, wet sieve
Magyar Aluminum ALO-P54-04 Alumina
Alumina for Polishing
Particle Size 45 µm
45 µm
0.5% max, wet sieve
Magyar Aluminum Zeolite
Particle Size 45 µm
45 µm
Maximum of 10% less than
H.C. Starck Amperit® 105.2 Agglomerated Sintered Molybdenum (Mo)
Particle Size 45 µm
45 µm
Maximum of 20% less than
H.C. Starck Amperit® 109.063 Agglomerated Sintered Molybdenum (Mo)
Particle Size 45 µm
45 µm
Maximum of 25% less than
H.C. Starck Amperit® 110.074 Agglomerated Sintered (Mo-Mo2C)
Particle Size 45 µm
45 µm
Maximum of 30%, Mo
H.C. Starck Amperit® 119.075 Molybdenum-Nickel SF RC 60 75-25 (Mo / NiSF)
Composition is of NiSF RC 60 only
Particle Size 45 µm
45 µm
Maximum of 13% less than
H.C. Starck Amperit® 175.2 Nickel (Ni)
Particle Size 45 µm
45 µm
Maximum of 7% greater than
H.C. Starck Amperit® 410.1 Gas Atomized (NiCoCrAlY)
Particle Size 45 µm
45 µm
Maximum of 7% greater than
H.C. Starck Amperit® 413.3 Gas Atomized (NiCoCrAlY)
Particle Size 45 µm
45 µm
Maximum of 10% less than
H.C. Starck Amperit® 518.002 Agglomerated, Sintered Tungsten Carbide-Cobalt 88-12 (WC-CO)
Particle Size 45 µm
45 µm
Maximum of 7% greater than, NiCr
H.C. Starck Amperit® 585.3 Chromium Carbide-Nickel Chromium 75-25 (Cr3C2-NiCr)
Composition is of Cr3C2 only
Particle Size 45 µm
45 µm
Maximum of 10% less than
H.C. Starck Amperit® 847.6 Agglomerated Yttria (Y2O3)
Particle Size 45 µm
45 µm
Maximum of 5% less than
H.C. Starck Amperit® 140.2 Tungsten (W)
HS Number: 81011000
Particle Size 45 µm
45 µm
Before Conversion
Silberline Extra Sparkle Silvet® 300-10-E1
Sparkle Silvet® E1 grades are easy to disperse and are compatible with a variety of polymers, particularly polyolefins. They are typically used to make concentrates or compounds for use in final ..
Particle Size 45 µm
45 µm
Before Conversion
Silberline Extra Sparkle Silvex® 300-10-D
Sparkle Silvex® D grades are aluminum pigment flakes dampened with a plasticizer to help prevent the individual flakes from becoming airborne during handling and processing. They are well suited ..
Particle Size 45 µm
45 µm
2 ppm sieve residue; ASTM D1514-01
TIMCAL ENSACO™ 150G Conductive Carbon Black
ENSACO™ & SUPER P™ conductive carbon blacks are carbon blacks with a high to very high void volume allowing the retention of a carbon network at low to very low filler content. The void volume can..
Particle Size 45 µm
45 µm
2 ppm sieve residue; ASTM D1514
TIMCAL ENSACO™ 210G Conductive Carbon Black
ENSACO™ & SUPER P™ conductive carbon blacks are carbon blacks with a high to very high void volume allowing the retention of a carbon network at low to very low filler content. The void volume can..
Particle Size <= 45 µm
<= 45 µm
Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy
Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe..
Particle Size <= 45 µm
<= 45 µm
Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy
Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology
Particle Size <= 45 µm
<= 45 µm
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
Particle Size <= 45 µm
<= 45 µm
Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy
Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte..
Particle Size <= 45 µm
<= 45 µm
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, ..
Particle Size <= 45 µm
<= 45 µm
Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electron..
Particle Size 45 - 151 µm
45 - 151 µm
Range (D10 to D90); Laser Diffraction
ALM FR 106 Nylon 11 SLS Prototyping Polymer
This flame retardant rapid prototyping material has additives in the raw material that allows it to pass aeronautic standard FAR25.853 smoke, flame, and toxicity tests. This material is ideal for Ae..
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