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Lord Adhesives Metech 3571 Silver Conductor Composition

Category Polymer , Adhesive
Manufacturer Lord Adhesives
Trade Name Metech
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
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Material Notes:
This high performance silver conductor is designed for cost sensitive hybrid applications. It employs advanced powders technology with a mix bonded frit system to yield a highly dense fired film that is resistant to solder leaching. It also exhibits excellent adhesion to beryllium oxide substrates.All information provided by Lord.
Physical Properties Metric English Comments
Brookfield Viscosity 170000 - 200000 cP

@Temperature 25.0 °C
170000 - 200000 cP

@Temperature 77.0 °F
HBT, Spindle #SC4-14 @ 10rpm
Thickness 11.0 - 13.0 microns
0.433 - 0.512 mil
Fired
Electrical Properties Metric English Comments
Surface Resistivity per Square <= 0.0015 ohm
<= 0.0015 ohm
Processing Properties Metric English Comments
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Adhesion 3-4
lbs; aged (500hrs. at 150ºC)
6-8
lbs; initial
Coverage (cm²/gm) 70-75
Calculated from 50 micron wet film
Line Resolution (microns) 125
Solder Leach Resistance (cycles) 5
Number of 5-second cycles required to leach 50% of a 10 mil wide conductive line using 62Sn/36Pb/2Ag at 230ºC
Solder Wetting (seconds) < 3
Time required to 100% solder wet 0.08" x 0.08" pad size using 62Sn/36Pb/2Ag at 230ºC
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