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Hexcel® Redux® 319L High Performance Modified Epoxy Film Adhesive (0.036 psf)

Category Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Hexcel
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexcel® Redux® 319L High Performance Modified Epoxy Film Adhesive (0.036 psf).pdf
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Material Notes:
Redux 319 is a high performance modified epoxy film adhesive curing at 350°F. It is available in both supported and unsupported versions at areal weights between 0.03 and 0.08 psf. The supported versions contain a woven nylon carrier for glueline thickness control and improved handleability. Redux 319 is a hot melt film which is free from solvents and consequently it has a very low volatile content.Features: Cures in 60 min at 350°F; Good performance at temperatures ranging from -67°F to 300°F; Good short-term exposure performance at 350°F; Excellent peel properties; Good drape at ambient temperatures; Less than 1% volatile content.Applications: Aluminum to aluminum bonding; Fiber-reinforced composite to composite bonding; Aluminum honeycomb sandwich bonding; Aramid honeycomb sandwich bonding.
Mechanical Properties Metric English Comments
Shear Strength 22.0 MPa

@Temperature 149 °C
3190 psi

@Temperature 300 °F
Lap Shear
42.0 MPa

@Temperature 22.2 °C
6090 psi

@Temperature 72.0 °F
Lap Shear
Peel Strength 6.84 kN/m

@Temperature 22.2 °C
39.0 pli

@Temperature 72.0 °F
Bell Peel
Processing Properties Metric English Comments
Shelf Life 18.0 Month

@Temperature -17.8 °C
18.0 Month

@Temperature 0.000 °F
Descriptive Properties Value Comments
Areal Weight (psf) 0.036
Climbing Drum Peel (in-lb/3in) 60.58
72°F
Standard Roll (ft2) 540
Support None
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