Songhan Plastic Technology Co.,Ltd.

Hexcel® Redux® 312 Modified epoxy film adhesive (0.015 psf)

Category Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Hexcel
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexcel® Redux® 312 Modified epoxy film adhesive (0.015 psf).pdf
  Online Service   lookpolymers   27660005
Material Notes:
Redux® 312 is a high-strength 250°F curing film adhesive, suitable for metal to metal bonding and sandwich constructions, where operating temperatures of up to 210°F may be experienced. A supported version, Redux® 312/5, is available with a woven nylon carrier for bond line thickness control.Features: Short cure cycle - cures in 30 minutes at 250°F; Good mechanical performance up to 210°F; Suitable for composite to composite bonding; Low volatile content (solventless process).Applications: Metal to metal bonding; Sandwich constructions; Composite to composite bonding.
Mechanical Properties Metric English Comments
Shear Strength 31.7 MPa

@Temperature 79.4 °C
4600 psi

@Temperature 175 °F
Lap Shear
33.1 MPa

@Temperature 71.1 °C
4800 psi

@Temperature 160 °F
Lap Shear
37.2 MPa

@Temperature 21.1 °C
5400 psi

@Temperature 70.0 °F
Lap Shear
Processing Properties Metric English Comments
Shelf Life 12.0 Month

@Temperature -17.8 °C
12.0 Month

@Temperature 0.000 °F
Descriptive Properties Value Comments
Areal Weight (psf) 0.015
Roll Width (in) 21
Standard Roll (ft2) 645
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