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Gwent Electronic Materials C2030529D2 Silver Via Ink

Category Fluid , Other Engineering Material , Additive/Filler for Polymer
Manufacturer Gwent Electronic Materials Ltd.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
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Material Notes:
This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive adhesive that combines good adhesion and electrical conductivity with chemical, environmental and abrasion resistance. It offers the advantage of a One-Pak cure system combined with the convenience of Ambient Temperature stability.Application: Through hole or via fillingInformation provided by Gwent Electronic Materials Ltd.
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 160 °C
0.500 hour

@Temperature 320 °F
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