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Aptek 2312-PMF Electrically conductive, low modulus adhesive

Category Polymer , Adhesive , Thermoset
Manufacturer Aptek Laboratories
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aptek 2312-PMF Electrically conductive, low modulus adhesive.pdf
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Material Notes:
Premixed-frozen, electrically conductive, low modulus adhesiveAPTEK 2312-PMF is a one component, premixed-frozen, silver filled, electrically conductive soft paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. APTEK 2312-PMF is a 100% solid, solvent free system that will not form voids during cure or outgas after being fully cured. Premixed-frozen and packaged in syringes for convenient dispensing to circuit board; Low modulus to minimize stress to sensitive components and ceramic substrates; Low Tg for excellent low temperature cycling and performance; Excellent substrate adhesion, superior to silicones; Available with spacer beads for precise bond line controlInformation provided by Aptek Laboratories, Inc.
Physical Properties Metric English Comments
Density 3.60 g/cc
0.130 lb/in³
ASTM D1475
Outgassing - Total Mass Loss 0.60 %
0.60 %
Cured property; at 10E-6 torr; ASTM E-595
Collected Volatile Condensable Material 0.020 %
0.020 %
Cured property; at 10E-6 torr; ASTM E595
Mechanical Properties Metric English Comments
Adhesive Bond Strength 1.38 MPa
200 psi
Al-to-Al Lap Shear; Cured property, scuff sanded, IPA wiped T3-202Al; cohesive failure; ASTM D1002
Thermal Properties Metric English Comments
Thermal Conductivity 1.76 W/m-K
12.2 BTU-in/hr-ft²-°F
COLORA
Glass Transition Temp, Tg <= -60.0 °C
<= -76.0 °F
Cured property; JMTP P-200
Flash Point >= 200 °C
>= 392 °F
ASTM D92
Electrical Properties Metric English Comments
Volume Resistivity 0.0050 ohm-cm
0.0050 ohm-cm
Cured property; ASTM D257
Processing Properties Metric English Comments
Processing Temperature 100 °C
212 °F
Cure 3 hrs
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