Electrical Properties | Metric | English | Comments |
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Volume Resistivity | <= 0.00070 ohm-cm | <= 0.00070 ohm-cm | |
Parker Chomerics CHO-BOND SV713 Conductive Epoxy CHO-BOND® 700 Series Adhesives for Microelectronics Packaging; these pure silver-filled epoxy pastes are designed to meet the demanding requirements of semiconductor and microelectronic packaging. .. |
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Volume Resistivity | >= 0.00070 ohm-cm | >= 0.00070 ohm-cm | 200°C/2 min |
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl.. |
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Volume Resistivity | <= 0.00070 ohm-cm | <= 0.00070 ohm-cm | |
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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Volume Resistivity | <= 0.00070 ohm-cm | <= 0.00070 ohm-cm | 25°C/40-60%RH/3 Day cure |
Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other.. |