Electrical Properties | Metric | English | Comments |
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Surface Resistance | <= 0.030 ohm | <= 0.030 ohm | |
P & P Technology M W Conductive Fabric Material: Nylon/PET/Nickel/Copper. Self Adhesive Tape: Standard double sided acrylic carrier and adhesiveInformation provided by P & P Technology |
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Surface Resistance | 0.030 ohm | 0.030 ohm | |
Parker Chomerics PREMIER™ A240-FRHF EMI Shielding Plastic Description: PREMIER™ is the world’s first and most versatile commercially available conductive thermoplastic for real world EMI shielding solutions. It is a blend of PC/ABS thermoplastic polymer .. |
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Surface Resistance | 0.030 ohm | 0.030 ohm | |
Parker Chomerics PREMIER™ A240-HTHF EMI Shielding Plastic Description: PREMIER™ is the world’s first and most versatile commercially available conductive thermoplastic for real world EMI shielding solutions. It is a blend of PC/ABS thermoplastic polymer .. |
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Surface Resistance | 0.030 ohm | 0.030 ohm | |
Parker Chomerics PREMIER™ A240-ST EMI Shielding Plastic Description: PREMIER™ is the world’s first and most versatile commercially available conductive thermoplastic for real world EMI shielding solutions. It is a blend of PC/ABS thermoplastic polymer .. |
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Surface Resistance | <= 0.030 ohm @Temperature 85.0 °C, Time 605000 sec |
<= 0.030 ohm @Temperature 185 °F, Time 168 hour |
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Parker Chomerics Tecknit Teckfip™ HC FIP-C Formed in Place Conductive Elastomer Description: Heat cure compound. This compound is an all round high performance compound, and is very similar to a Consil C molded or extruded elastomer. It has been traditionally used for telecommu.. |
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Surface Resistance | <= 0.030 ohm @Temperature 85.0 °C, Time 605000 sec |
<= 0.030 ohm @Temperature 185 °F, Time 168 hour |
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Parker Chomerics Tecknit Teckfip™ HC FIP-E Formed in Place Conductive Elastomer Heat cure compound. Commercial grade FIP compound designed for moderate shielding performance. The Ag/glass particles are very smooth which leads to very low compression set value.Information provid.. |