Polymer Property : Cure Time = 1.25 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	75.0 min	1.25 hour	30 min @ 100-120°C + 45 min @ 150°C
Tra-Con Tra-Bond 526W01 Microelectronics Grade Encapsulant TRA-BOND 526W01 is a one component micro-electronics grade controlled flow encapsulant designed to protect wire bonds and bare die. TRA-BOND 526W01 has a low coefficient of thermal expansion and low..
Cure Time	75.0 min @Temperature 4.00 °C	1.25 hour @Temperature 39.2 °F	Full Chemical
Chesterton ARC 5ES Rapid Repair Stick Description: ARC 5ES is specifically formulated for quick reliable repairs. Its “stick” design combines the performance of a two component system with the convenience of a single component. The AR..