Polymer Property : Cure Time = 40.0 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	40.0 min @Temperature 150 °C	0.667 hour @Temperature 302 °F
Resinlab® EP950G Gray Aluminum Filled Rubber Modified Epoxy EP950G Gray is an aluminum filled one part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated temperature. It is a medium paste-like viscosi..
Cure Time	40.0 min @Temperature 150 °C	0.667 hour @Temperature 302 °F
Resinlab® EP950NMF Gray Non-Metallic Filled Rubber Modified Epoxy Resinlab™ EP950NMF Gray is a non-metallic filled version of EP950G. It is a one-part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated tem..
Cure Time	40.0 min @Temperature 95.0 Â°C	0.667 hour @Temperature 203 Â°F	Complete
Lord Adhesives Thermosetâ„¢ MD-200 Electrically Conductive Die-Attach Adhesive This is a system with the versatility to fit a wide variety of production and performance needs. The working life allows sufficient time for short production interruption. It can be initially cured ..
Cure Time	40.0 min @Temperature 140 °C	0.667 hour @Temperature 284 °F
Trelleborg Emerson & Cuming Eccobond® 2780-45 One-Component High Temperature Performance Epoxy Adhesive Emerson & Cuming 2780-45 Eccobond® One-Component High Temperature Performance Epoxy AdhesiveFilled, pourable, high temperature resistant, epoxy adhesive. Long term resistance to boiling glycol. Exc..
Cure Time	40.0 min @Temperature 70.0 °C	0.667 hour @Temperature 158 °F
Dow Corning Q3-6575 DIELECTRIC GEL A/B KIT Two-part, clear, RT or heat cure and low temperature (-80°C/-112°F)stability.Information provided by Dow Corning
Cure Time	40.0 min @Temperature 180 °C	0.667 hour @Temperature 356 °F
Abatron AboWeld 8708-7 One-Component Structural/Dielectric Epoxy AboWeld 8708-7 is a highly filled, class H (180°C) structural, heat-conductive adhesive paste for FASTER high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulatin..
Cure Time	40.0 min @Temperature 150 °C	0.667 hour @Temperature 302 °F
Abatron AboWeld 8708-8 One-Component Structural/Dielectric Epoxy AboWeld 8708-8 is a highly filled, class H (180°C) structural, heat-conductive adhesive paste for FAST high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating;..
Cure Time	40.0 min @Temperature 149 °C	0.667 hour @Temperature 300 °F
3M Scotchcast™ 262 Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 262 is a widely used, well-known general purpose epoxy powder resin. A one-part, red pigmented, rapid heat-curing product, it is designed to provide a continuous, toug..
Cure Time	40.0 min @Temperature 150 °C	0.667 hour @Temperature 302 °F
Abatron AboCast 8708-10 One-Component Structural/Dielectric Epoxy AboCast 8708-10 is a highly filled, class H (180°C) structural, castable adhesive compound for FAST high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; Em..
Cure Time	40.0 min @Temperature 180 °C	0.667 hour @Temperature 356 °F
Abatron AboCast 8708-9 One-Component Structural/Dielectric Epoxy AboCast 8708-9 is a highly filled, class H (180°C) structural, castable adhesive compound for FASTER high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; E..