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Lord Adhesives Thermosetâ„¢ MD-200 Electrically Conductive Die-Attach Adhesive
| Category | Polymer , Adhesive |
| Manufacturer | Lord Adhesives |
| Trade Name | Thermoset™ |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Lord Adhesives Thermosetâ„¢ MD-200 Electrically Conductive Die-Attach Adhesive.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
This is a system with the versatility to fit a wide variety of production and performance needs. The working life allows sufficient time for short production interruption. It can be initially cured at room temperature in 24 hours. Suitable for applications in which the part will not tolerate elevated temperatures. The cure schedule can also be shortened to 40 minutes by oven curing.Intended Use: Chip-on-board die-attach.All information provided by Lord.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 2.75 g/cc | 2.75 g/cc | |
| Viscosity | 70000 cP @Temperature 25.0 °C |
70000 cP @Temperature 77.0 °F |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 85 | 85 | ASTM D2240 |
| Shear Strength | 10.3 MPa @Temperature 25.0 °C |
1500 psi @Temperature 77.0 °F |
Die; 0.05" x 0.05" IC; Chatillon Force Gauge Model DPP-25 |
| 10.3 MPa @Temperature 25.0 °C |
1500 psi @Temperature 77.0 °F |
Tensile; ASTM D1002 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Thermal Conductivity | 2.09 W/m-K | 14.5 BTU-in/hr-ft²-°F | |
| Glass Transition Temp, Tg | 105 °C | 221 °F | Perkin-Elmer DSC-2 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 40.0 min @Temperature 95.0 °C |
0.667 hour @Temperature 203 °F |
Complete |
| 180 min @Temperature 65.0 °C |
3.00 hour @Temperature 149 °F |
Complete | |
| 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
Initial | |
| 4320 - 7200 min @Temperature 25.0 °C |
72.0 - 120 hour @Temperature 77.0 °F |
Complete | |
| Pot Life | 60 min @Temperature 25.0 °C |
60 min @Temperature 77.0 °F |
|
| Shelf Life | 6.00 Month @Temperature 25.0 °C |
6.00 Month @Temperature 77.0 °F |
Resin |
| 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
Hardener |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Appearance | Silver | |
| Mix Ratio | 100:10 | by weight |
| 100:35 | by volume |
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