Thermal Properties | Metric | English | Comments |
---|---|---|---|
Thermal Conductivity | 0.0380 W/m-K @Temperature 10.0 °C |
0.264 BTU-in/hr-ft²-°F @Temperature 50.0 °F |
@ 110 kg/m³; ASTM C177, ISO 8302, DIN EN-12667:2001-05 |
Microtherm Group MT Thermosphere® Moldable Insulation Paste MT Thermosphere® is a low density temperature resistant paste with excellent thermal insulation properties from cryogenic to high temperature exposure. It is a perfectly seamless insulation syste.. |
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Thermal Conductivity | 0.0380 W/m-K @Temperature 800 °C |
0.264 BTU-in/hr-ft²-°F @Temperature 1470 °F |
DIN 51046 |
Unifrax Excelfrax® 1800 Board Microporous Insulation Unifrax Corporation's Excelfrax® product line, based on advanced microporous insulation technology, is a family of products which all exhibit superior insulating characteristics. Excelfrax micropo.. |
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Thermal Conductivity | 0.0380 W/m-K @Temperature 800 °C |
0.264 BTU-in/hr-ft²-°F @Temperature 1470 °F |
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Zircar Ceramics MICROSIL Microporous Insulation MICROSIL Microporous Insulation is an insulation material. Having thermal conductivity an order of magnitude lower than ceramic fiber materials Microsil Microporous Insulation can be an integral par.. |