Thermal Properties | Metric | English | Comments |
---|---|---|---|
Thermal Conductivity | >= 380 W/m-K | >= 2640 BTU-in/hr-ft²-°F | Cu Layer; ASTM 1461-01 |
Plansee Cu-MoCu-Cu Laminate A high performance, three-layer composite.Characteristics:High thermal conductivityLow thermal expansionIdeal for heat dissipation applications related to: IGBT modules, RF packages, and LED chips, .. |