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Plansee Cu-MoCu-Cu Laminate

Category Metal , Metal Matrix Composite , Nonferrous Metal , Molybdenum Alloy
Manufacturer Plansee SE
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Plansee Cu-MoCu-Cu Laminate.pdf
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Material Notes:
A high performance, three-layer composite.Characteristics:High thermal conductivityLow thermal expansionIdeal for heat dissipation applications related to: IGBT modules, RF packages, and LED chips, among others. This laminate is compatible with silcon, GaAs and GaN-based semi-conductor materials.Information provided by Plansee.
Physical Properties Metric English Comments
Density 9.50 g/cc
0.343 lb/in³
DIN 3369
Mechanical Properties Metric English Comments
Hardness, Vickers 80 - 120
80 - 120
HV<sub>0.1</sub>; Cu Layer; ISO 6507-1
Tensile Strength, Yield 630 MPa
91400 psi
0.2%; EN 10002-1
Modulus of Elasticity 195 GPa
28300 ksi
EN 10002-1
Thermal Properties Metric English Comments
CTE, linear 8.00 - 10.0 µm/m-°C
4.44 - 5.56 µin/in-°F
DIN 51045
Thermal Conductivity >= 170 W/m-K
>= 1180 BTU-in/hr-ft²-°F
Through Plane; ASTM 1461-01
>= 260 W/m-K
>= 1800 BTU-in/hr-ft²-°F
In Plane; ASTM 1461-01
>= 380 W/m-K
>= 2640 BTU-in/hr-ft²-°F
Cu Layer; ASTM 1461-01
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