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Polymer Property : Thermal Conductivity = 1530 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 210 - 220 W/m-K
1460 - 1530 BTU-in/hr-ft²-°F
x-y direction
MarkeTech Cu/Mo/Cu 1:4:1 Laminated Sheet
Cu/MoCu sheets have very high in-plane thermal conductivity provide by layers of Cu and low CTEs provided by the inner layer of molybdenum. These laminated sheets spread heat from a concentrated hea..
Thermal Conductivity 210 - 220 W/m-K
1460 - 1530 BTU-in/hr-ft²-°F
x-y direction
MarkeTech Cu/Mo70-Cu30/Cu 1:4:1 Laminated Sheet
Cu/Mo/Cu sheets have very high in-plane thermal conductivity provide by layers of Cu and low CTEs provided by the inner layer of molybdenum. These laminated sheets spread heat from a concentrated he..
Thermal Conductivity 200 - 220 W/m-K
1390 - 1530 BTU-in/hr-ft²-°F
MarkeTech Mo60Cu Moly/Copper Heat Sink Material
MoCu alloys are made by sintering molybdenum and copper together. This results in a heat sink of lower density than tungsten-based materials, low thermal expansion, and excellent thermal conductivit..
Thermal Conductivity 200 - 220 W/m-K
1390 - 1530 BTU-in/hr-ft²-°F
MarkeTech W80Cu Tungsten/Copper Heat Sink Material
WCu composites are made by vacuum infiltration of uniform controlled porous blocks of tungsten with molten copper. This results in a material with an interconnected Cu matrix that has high thermal c..
Thermal Conductivity 200 - 220 W/m-K
1390 - 1530 BTU-in/hr-ft²-°F
MarkeTech WCu20 Tungsten Copper Alloy
Used to fabricate parts to near net size and several processes to produce high quality tungsten based materials.Tungsten heavy alloys have very high melting point and have a density twice that of st..
Thermal Conductivity 140 - 220 W/m-K
972 - 1530 BTU-in/hr-ft²-°F
H.C. Starck WCu 80/20 Tungsten-Copper Composite Material
Description of Product: Tungsten-copper composite materials are produced by copper infiltration of porous sintered tungsten. They are available with different copper contents (10 - 30 %). A therm..
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