Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 215 W/m-K | 1490 BTU-in/hr-ft²-°F | |
Plansee MoCu40 Molybdenum-Copper Characteristics:High thermal conductivityLow thermal expansionIdeal for heat dissipation applications related to: IGBT modules, RF packages, and LED chips, among others.Information provided by Plans.. |
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Thermal Conductivity | 215 W/m-K | 1490 BTU-in/hr-ft²-°F | greater than pure W |
Plansee W-15Cu Tungsten-Copper Composite This composite material is composed of a porous tungsten matrix which is infiltrated with copper.Characteristics:Very resistant to arc erosionGood electrical conductivityHigh thermal conductivityLow.. |
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Thermal Conductivity | <= 214 W/m-K | <= 1490 BTU-in/hr-ft²-°F | In-Plane; Angstrom's Method |
GrafTech GRAFCELL® GDB Graphite Gas Diffusion Barrier GRAFCELL® Gas Diffusion Barrier (GDB) material is a thin, perforated structure made from a continuous matrix of expanded natural graphite with excellent electrical conductivity, thermal conductiv.. |