Polymer Property : Thermal Conductivity = 1.22 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	1.22 - 1.94 W/m-K @Temperature 100 - 100 °C	8.47 - 13.5 BTU-in/hr-ft²-°F @Temperature 212 - 212 °F	Average value: 1.58 W/m-K Grade Count:2
Overview of materials for Phenolic, Novolac, Mineral/Graphite Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Mineral/Graphite Filled". Each property range of values reported is minimum and maxim..
Thermal Conductivity	1.22 W/m-K	8.47 BTU-in/hr-ftÂ²-Â°F
Sharadaa Ceramics REFINSUL 7 Insulating Castables Medium/High Purity Description: We offer our clients Insulating Castables that are available in medium as well as high purity. Widely used in various industries, these are renowned for their strength and heat resistan..
Thermal Conductivity	1.22 W/m-K	8.47 BTU-in/hr-ftÂ²-Â°F	ASTM C518
Sumitomo Bakelite North America FM 4005X4648 Fiberglass Reinforced Phenolic Novolac FM 4005X4648 a fiberglass reinforced phenolic novolac molding compound formulated to increase thermal conductivity and electrical conductance. This material also exhibits low post mold shrinkage.In..
Thermal Conductivity	1.22 W/m-K @Temperature 100 °C	8.47 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 5118 Phenolic, Granular, Compression Molded PLENCO 05118 is a mineral and graphite filled phenolic molding compound, formulated for bearing seals. 05118 provides for a low coefficient of friction, abrasion resistance, minimal water absorptio..
Thermal Conductivity	1.22 W/m-K @Temperature 900 °C	8.47 BTU-in/hr-ft²-°F @Temperature 1650 °F
COI Ceramics Friable Graded Insulation Description: An example of a bonded product comprised of oxide spheres is Friable Graded Insulation or FGI. FGI can be bonded to an oxide ceramic matrix composite such as A/N720 to produce a CMC/FGI..
Thermal Conductivity	1.22 W/m-K	8.50 BTU-in/hr-ft²-°F
Atom Adhesives AA-CARB 61 Epoxy Adhesive AA-CARB 61 is an epoxy adhesive and coating formulation based on conductive carbon. AA-CARB 61 is recommended for electronic bonding and sealing applications that require both fine electrical and me..